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Finite Element Analysis of the Mechanical Performance of Benzocyclobutene Structures in Multichip Modules.

Published online by Cambridge University Press:  22 February 2011

E. O. Shaffer II ,
P. H. Townsend ,
M. J. Radler  and
C. J. Carriere
E. O. Shaffer II
Affiliation:
The Dow Chemical Company, M. E.Pruitt Research Center 1702 Building, Midland, MI 48674.
P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E.Pruitt Research Center 1702 Building, Midland, MI 48674.
M. J. Radler
Affiliation:
The Dow Chemical Company, M. E.Pruitt Research Center 1702 Building, Midland, MI 48674.
C. J. Carriere
Affiliation:
The Dow Chemical Company, M. E.Pruitt Research Center 1702 Building, Midland, MI 48674.
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Abstract

Polymeric materials are used as interlayer dielectrics for multichip modules. One of the central challenges for these structures is management of the large stresses induced by the differences in the thermal properties of the inorganic component structures and the organic film during processing.

Finite clement analysis has been used to model the stresses in the dielectric material in practical structures used in multilayer microelectronic architecture, such as interlayer vias and the associated internal metal patterns. Calculations have been performed on the stress field at the corner of square vias in benzocyclobutcne based interlayer dielectrics and related polymeric materials. The effects of the thermal and mechanical properties of the polymeric coating on the stress fields in metal patterns have been calculated and provide insight for design and process optimization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 163
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

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