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Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

  • Tao Liu (a1), M. A. Korhonen (a1), S. Ting (a1), D. Kim (a1) and C.-Y. Li (a1)...

Abstract

Reliability of solder interconnects is normally characterized by extrapolation of bulk solder reliability data, such as crack growth measurements of solder materials in the bulk form. In the present study, experimental evidence will be presented to show that crack growth, which is the most commonly observed failure mode in small solder joints strongly depends on the size and shape of the joint cross-section. Furthermore, the crack growth rate can be appropriately correlated to the size of the intense plastic yielding zone at the crack tip using a plastic decohesion argument.

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References

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1. Agarwala, B.N., International Reliability Physics Symposium (IEEE/IRPS), 1985, pp. 198205
2. Nagesh, V.K., International Reliability Physics Symposium (IEEE/IRPS), 1982, pp. 615
3. Edwards, L. and Zhang, Y.H., Acta Metall. Mater. 42, 1994, pp. 14131421
4. Tomkins, B., Philosophical Magazine, 18, 1968, pp. 10411066
5. Skelton, R.P., in Low Cycle Fatigue, ed. Solomon, H.D., Halford, G.R., Kaisand, L.R., and Leis, B.N., ASTM/STP 942, 1988

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