Hostname: page-component-5c6d5d7d68-vt8vv Total loading time: 0.001 Render date: 2024-08-25T23:57:02.944Z Has data issue: false hasContentIssue false

Extrinsic Performance Limitations of AlGaN/GaN Heterostructure Field Effect Transistors

Published online by Cambridge University Press:  15 February 2011

P.P. Ruden
Affiliation:
ECE Department, University of Minnesota, Minneapolis, MN 55455
J.D. Albrecht
Affiliation:
ECE Department, University of Minnesota, Minneapolis, MN 55455
A. Sutandi
Affiliation:
ECE Department, University of Minnesota, Minneapolis, MN 55455
S.C. Binaril
Affiliation:
ECE Department, University of Minnesota, Minneapolis, MN 55455
K. Ikossi-Anastasiou
Affiliation:
ECE Department, University of Minnesota, Minneapolis, MN 55455
M.G. Ancona
Affiliation:
Electronics Science and Technology Div., Naval Research Laboratory, Washington, DC 20375
R.L. Henry
Affiliation:
Electronics Science and Technology Div., Naval Research Laboratory, Washington, DC 20375
D.D. Kolesket
Affiliation:
Electronics Science and Technology Div., Naval Research Laboratory, Washington, DC 20375
A.E. Wickendent
Affiliation:
Electronics Science and Technology Div., Naval Research Laboratory, Washington, DC 20375
Get access

Abstract

Extrinsic effects on the DC output characteristics of AlGaN/GaN HFETs with lllm gate lengths are examined. The devices investigated were fabricated on MOCVD-grown AlGaN/GaN heterostructures on sapphire substrates. An analytical model that takes into account parasitic resistances and thermal effects is constructed, and its results are compared with experimental data. With parameters determined from characterization experiments on the same wafer and from independent theoretical results, the agreement between the data and the model predictions is found to be very good. The model is then applied to performance predictions for devices with improved series resistances and heat sinking.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Nguyen, N.X., Nguyen, C., and Grider, D.E., Electronics Lett., 34, 811 (1998).Google Scholar
2. Sullivan, G.J., Higgins, J.A., Chen, M.Y., Yang, J.W., Chen, Q., Pierson, R.L., and McDermott, B.T., Electronics Lett., 34, 922 (1998).Google Scholar
3. Sheppard, S.T., Doverspike, K., Pribble, W.L., Allen, S.T., Palmour, J.W., Kehias, L.T., and Jenkins, T.J., Abstracts of 1998 Device Research Conference, Charlottesville, VA (1998).Google Scholar
4. Ruden, P.P., IEEE Trans. Electron Devices, 37, 2267 (1990).Google Scholar
5. Albrecht, J.D., Wang, R.P., Ruden, P.P., Farahmand, M., and Brennan, K.F., J. Appl. Phys., 83, 4777 (1998).Google Scholar
6. Shur, M., Physics of Semiconductor Devices, Prentice-Hall, Inc., Englewood Cliffs, NJ (1990).Google Scholar
7. Ando, T., Fowler, A.B., Stern, F., Rev. Mod. Phys., 54, 437 (1982).Google Scholar
8. Ruden, P.P., Shur, M., Akinwande, A.I., Nohava, J.C., Grider, D.E., and Baek, J., IEEE Trans. Electron Devices, 37, 2171 (1990).Google Scholar
9. Ikossi-Anastasiou, K., Ezis, A., and Rai, A.K., IEEE Trans. Electron Devices, 35, 1786 (1988).Google Scholar