Hostname: page-component-77c89778f8-rkxrd Total loading time: 0 Render date: 2024-07-19T09:38:00.698Z Has data issue: false hasContentIssue false

Excimer-Laser Crystallization of Patterned Si Films At High Temperatures Via Artificially Controlled Super-Lateral Growth

Published online by Cambridge University Press:  15 February 2011

H. Jin Song
Affiliation:
Department of Chemical Engineering, Materials Science, and Mining Engineering, Columbia University, New York, New York 10027
James S. Im
Affiliation:
Department of Chemical Engineering, Materials Science, and Mining Engineering, Columbia University, New York, New York 10027
Get access

Abstract

Based on the artificially controlled super-lateral growth approach, we have developed a novel excimer-laser-based high-substrate-temperature method for producing single-crystal Si islands on SiO2. By irradiating a photolithographically preconfigured sample, complete melting of an Si film is induced only at precisely predesignated locations within patterned and physically isolated islands. An intentionally incompletely melted section within each island initiates lateral growth of crystalline grains. A “bottleneck” portion of the island permits only one of the laterally growing grains to propagate into the main portion of the island. The low nucleation-to-growth-rate ratios that are attainable with high substrate temperatures (1000–1200 °C) can lead to nearly unlimited lateral growth distances; with a proper combination of the substrate temperature and the island dimension, the main area of an island—up to 50×50 μm2 in area—is readily converted into a large single-crystal region.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kamins, T., Polycrystalline Silicon for Integrated Circuit Applications (Kluwer, Boston, 1988).Google Scholar
2 Ornara, W. C., Liquid Crystal Displays; Manufacturing Science and Technology (Van Nostrand and Reinhold, New York, 1993).Google Scholar
3 Sameshima, T. and Usui, S., Mat. Res. Soc. Symp. Proc. 71, 435 (1986).Google Scholar
4 Im, James S., Kim, H. J., and Thompson, M. O., Appl. Phys. Lett. 63, 1969 (1993). H. J. Kim, James S. Im, and M. O. Thompson, Mat. Res. Soc. Symp. Proc. 283, 703 (1993).Google Scholar
5 Johnson, R. I., Anderson, G. B., Boyce, J. B., Fork, D. K., Mei, P., Ready, S. E., and Chen, S., Mat. Res. Soc. Symp. Proc. 297, 533 (1993).Google Scholar
6 Im, James S. and Sposili, Robert S., to be published in Materials Research Society Bulletin, vol. xxi, no. 3 (1996).Google Scholar
7 Kim, H. J. and Im, James S., Mat. Res. Soc. Symp. Proc. 358, 903 (1995).Google Scholar
8 Im, James S. and Kim, H. J., Appl. Phys. Lett. 64, 2303 (1994).Google Scholar
9 Cohen, S. A., Sedgwick, T. O., and Speidel, J. L., Mat. Res. Soc. Symp. Proc. 23, 321 (1984).Google Scholar
10 Givargizov, E. I., Oriented Crystallization on Amorphous Substrates (Plenum, New York, 1991).Google Scholar
11 Christian, J. W., The Theory of Transformations in Metals and Alloys (Pergamon, Oxford, 1965).Google Scholar
12 Spaepen, F. and Turnbull, D., in Laser Annealing of Semiconductors, edited by Poate, J. M. and Mayer, James W. (Academic, New York, 1982).Google Scholar
13 Colinge, J. P., Silicon-on-Insulator Technology : Materials to VLSI (Kluwer, Boston, 1991).Google Scholar