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Evolution of SOI MOSFETs: from Single Gate to Multiple Gates

Published online by Cambridge University Press:  01 February 2011

Jean-Pierre Colinge*
Affiliation:
Department of Electrical and Computer Engineering University of California Davis, CA 95616, USA
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Abstract

To improve short-channel characteristics and increase current drive, SOI technology is shifting focus from “classical” single-gate MOSFET architectures to multiple-gate device structures. This paper traces the history of single- and multiple-gate SOI MOSFETs and summarizes the electrical characteristics of such devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

[1] Mueller, C.W. and Robinson, P.H., Proc. IEEE 52, 1487, (1964)Google Scholar
[2] Ipri, A.C., “The Properties of Silicon-on-Sapphire Substrates, Devices, and Integrated Circuits”, Silicon Integrated Circuits, Part A, Applied Solid State Science, Supplement 2 (Academic Press, 1981) pp. 253395 Google Scholar
[3] Reedy, R., Cable, J., Kelly, D., Stuber, M., Wright, F. and Wu, G., Analog Integrated Circuits and Signal Processing 25, 171, (2000)Google Scholar
[4] Megahed, M., burgener, M., Cable, J., Benton, R., Staab, D., Stuber, M., Dennies, P. and Reedy, J., IEEE MTT-S International Microwave Symposium Digest, 981, 1998 Google Scholar
[5] Megahed, M., Burgener, M., Cable, J., Staab, D. and Reedy, R., IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Digest of Papers, 94 (1998)Google Scholar
[6] Colinge, J.P., IEEE Trans. Electron Devices 34, 845 (1987)Google Scholar
[7] Parke, S. A., Hu, C., and Ko, P. K., IEEE Electron Device Lett. 14, 234 (1993)Google Scholar
[8] Rofail, S. S., and Seng, Y. K., IEEE Trans. Electron Devices 44, 1473 (1997)Google Scholar
[9] Yan, Z., Deen, M. J., and Malhi, D. S., IEEE Trans. Electron Devices 44, 118 (1997)Google Scholar
[10] Douseki, T., Shigematsu, S., Yamada, J., Harada, M., Inokawa, H., and Tsuchiya, T., IEEE Journal of Solid-State Circuits 32, 1604 (1997)Google Scholar
[11] Assaderaghi, F., Sinitsky, D., Parke, S. A., Bokor, J., Ko, P. K., and Hu, C., Tech. Digest of IEDM, 809 (1994)Google Scholar
[12] Ferlet-Cavrois, V., Bracale, A., Fel, N., Musseau, O., Raynaud, C., Faynot, O. and Pelloie, J.L., Proceedings IEEE Intl. SOI Conference, 24, (1999)Google Scholar
[13] Douseki, T., Morisawa, F., Nakata, S. and Ohtomo, Y., Extended Abstracts of the International Conference on Solid-State Devices and Materials (SSDM), 264 (2001)Google Scholar
[14] Sturm, J.C., Tokunaga, K. and Colinge, J.P., IEEE-Electron Dev. Lett. 9, 460 (1988)Google Scholar
[15] Colinge, J.P., IEEE Electron Device Letters 7, 244 (1986)Google Scholar
[16] Colinge, J.P., Electronics Letters 24, 257 (1988)Google Scholar
[17] Sekigawa, T. and Hayashi, Y., Solid-State Electronics 27 827, 1984 Google Scholar
[18] Hisamoto, D., Kaga, T., Kawamoto, Y. and Takeda, E., Technical Digest of IEDM, 833 (1989)Google Scholar
[19] Huang, X., Lee, W.C., Kuo, C., Hisamoto, D., Chang, L., Kedzierski, J., Anderson, E., Takeuchi, H., Choi, Y.K., Asano, K., Subramanian, V., King, T.J., Bokor, J., Sub, C. Hu, Technical digest ofIEDM, 67 (1999)Google Scholar
[20] Hiramoto, T., IEEE International SOI Conference Proceedings, 8 (2001)Google Scholar
[21] Jiao, Z. and Salama, A.T., Electrochem. Society Proceedings 2001-3, 403 (2001)Google Scholar
[22] Balestra, F., Cristoloveanu, S., Benachir, M. and Elewa, T., IEEE Electron Device Letters, 8, 410, (1987)Google Scholar
[23] Colinge, J.P., Gao, M.H., Romano, A., Maes, H., and Claeys, C., Technical Digest of IEDM, 595, 1990 Google Scholar
[24] Baie, X., Colinge, J.P., Bayot, V. and Grivei, E., Proceedings IEEE International SOI Conference, 66 (1995)Google Scholar
[25] Chau, R., Doyle, B., Kavalieros, J., Barlage, D., Murthy, A., Dozky, M., Arghavani, R. and Datta, S., Ext. abstracts of the international Conference on Solid State Devices and Materials (SSDM), p 68, 2002 Google Scholar
[26] Park, J.T., Colinge, J.P. and Diaz, C. H., IEEE Electron Device Letters, 22, 405 (2001)Google Scholar
[27] Yang, F.-L., Chen, H.-Y., Cheng, F.-C., Huang, C.-C., Chang, C.-Y., Chiu, H.-K., Lee, C.-C., Chen, C.-C. Huang, H.-T., Chen, C.-J., Tao, H.-J., Yeo, Y.-C., Liang, M.-S., and Hu, C., Technical Digest of IEDM, 255 (2002)Google Scholar
[28] Miyano, S., Hirose, M., Masuoka, F., IEEE Transactions on Electron Devices 39, 1876 (1992)Google Scholar
[29] Nitayama, A., Takato, H., Okabe, N., Sunouchi, K., Hieda, K., Horiguchi, F., Masuoka, F., IEEE Transactions on Electron Devices. 38 579 (1991)Google Scholar
[30] Yan, R.H., Ourmazd, A. and Lee, K.F., IEEE Trans. Electron Dev. 39, 1704, (1992)Google Scholar
[31] Suzuki, K., Tanaka, T., Tosaka, Y., Horie, H. and Arimoto, Y., IEEE Trans. Electron Dev. 40, 2326, (1993)Google Scholar
[32] Auth, C.P. and Plummer, J.D., IEEE Electron Dev. Lett. 18, 74, (1997)Google Scholar
[33] Ernst, T., Munteanu, D., Cristoloveanu, S., Ouisse, T., Horiguchi, S., Ono, Y., Takahashi, Y., Murase, K.,. Microelectronic Engineering 48, 339 (1999)Google Scholar
[34] Mastrapasqua, M., Esseni, D., Celler, G.K., Baumann, F.H., Fiegna, C., Selmi, L., Sangiorgi, E., Silicon-on-Insulator Technology and Devices X, Electrochemical Society Proceedings 2001-3, 97, (2001)Google Scholar
[35] Ernst, T., Munteanu, D., Cristoloveanu, S., Ouisse, T., Hefyene, N., Horiguchi, S., Ono, Y., Takahashi, Y., Murase, K., IEEE International SOI Conference. Proceedings, 92–3 (1999)Google Scholar
[36] J.T. Park and Colinge, J.P., IEEE Transactions on Electron Devices 49, 2222 (2002)Google Scholar
[37] US patent 6,359,311Google Scholar