Skip to main content Accessibility help
×
Home

Evaluation of Interface Strength between a Copper Submicron Dot and Silicondioxide Substrate

  • Hiroyuki Hirakata (a1), Takayuki Kitamura (a1) and Yoshitake Yamamoto (a1)

Abstract

An experimental evaluation method of interface strength between ductile submicron-dots and a hard substrate is developed. The validity is examined with copper (Cu) cylindrical dots of submicron scale on a silicondioxide (SiO2) substrate. A hard-layer of tungsten (W) is employed to restrain the deformation and concentrate the stress near the free-edge of Cu/SiO2. A diamond tip is dragged horizontally along the SiO2 surface and the load is applied to the side edge of the W layer at a constant displacement rate using a modified atomic force microscope. Both the lateral and the vertical loads and displacements are continuously monitored during the test. After the tip hits the W layer, the lateral load, F l, increases almost proportionally with the lateral displacement, σl. The Cu dot with the W layer then is clearly separated from the SiO2 along the interface. The restraint by the W layer works well so that there are little damages in both the delaminated W/Cu dot and the substrate. The delamination lateral load, F lC, is successfully evaluated.

Copyright

References

Hide All
1. Baba, S., Kikuchi, A. and Kinbara, A., J. Vac. Sci. Technol. A 4, 3015 (1986).
2. Venkataraman, S., Kohlstedt, D. L. and Gerberich, W. W., J. Mater. Res. 11–12, 3133 (1996).
3. Kriese, M. D., Gerberich, W. W. and Moody, N. R., J. Mater. Res. 14, 3007 (1999).
4. Marshall, D. B. and Evans, A. G., J. Appl. Phys. 56, 2632 (1984).
5. Kamiya, S., Kimura, H., Yamanobe, K., Saka, M. and Abe, H., Thin Solid Films 414, 91 (2002).
6. Boer, M. P. de, Kriese, M. D. and Gerberich, W. W., J. Mater. Res. 12, 2673 (1997).
7. Dauskardt, R. H., Lane, M., Ma, Q. and Krishna, N., Engng. Fract. Mech. 61, 141 (1998).
8. Butler, D. W., J. Phys. E 3, 979 (1970).
9. Kitamura, T., Shibutani, T. and Ueno, T., Engng. Fract. Mech. 69, 1289 (2002).
10. Kitamura, T., Hirakata, H. and Itsuji, T., Engng. Fract. Mech. 70, 2089 (2003).
11. Bagchi, A., Lucas, G. E., Suo, Z. and Evans, A. G., J. Mater. Res. 9, 1734 (1994).
12. Kinbara, A., Kusano, E., Kamiya, T., Kondo, I. and Takenaka, O., Thin Solid Films 317, 165 (1998).
13. Becker, T. L. Jr., McNancy, J. M., Cannon, R. M. and Ritchie, R. O., Mech. Mater. 25, 291 (1997).
14. Hirakata, H., Kitamura, T. and Yamamoto, Y., Int. J. Solids Struct. 41, 3243 (2004)
15. Hommel, M. and Kraft, O., Acta Mater. 49, 3935 (2001).

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed