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Establishing a Quantitative Relationship Between Harmonic Signals and Damage in Interconnects

Published online by Cambridge University Press:  15 February 2011

Qingzhe Wen  and
David R. Clarke
Qingzhe Wen
Affiliation:
Materials Department, University of California, Santa Barbara, CA 93106-5050wen@sisyphus.uscb.edu, clarke@engineering.ucsb.edu
David R. Clarke
Affiliation:
Materials Department, University of California, Santa Barbara, CA 93106-5050wen@sisyphus.uscb.edu, clarke@engineering.ucsb.edu
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Abstract

When a metal conductor is driven by an AC current of frequency ω, its resistance will vary at a frequency 2ω, and a third harmonic voltage will be generated. If the conductor is also under a DC bias, a second harmonic voltage will arise as well. The magnitude of these harmonic voltages increases with damage because of nonlinear increases in the resistance caused by localized Joule heating. We use the harmonic technique to evaluate the damage in metal lines. The correlation between deliberately introduced defects of different sizes and the amplitude of the harmonic voltages has been studied experimentally. The harmonic technique shows higher damage sensitivity than the commonly used resistance method. Additionally, it has a better rejection to noise and resistance drifting.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 141
Copyright
Copyright © Materials Research Society 1996

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References

1. d'Heurle, F. M. and Ho, P. S., in Thin Films – Interdiffusion and Reactions, Wiley-Interscience Publication, New York, 243(1978)Google Scholar
2. Chen, T. M. and Yassine, A. M., IEEE Transactions on Electron Devices, 41 (11), 2165 (1994)Google Scholar
3. Jones, B. K. and Xu, Y. Z., Rev. Sci. Instrum. 66 (9), 4676 (1995)Google Scholar
4. Arzt, E., Kraft, O., Nix, W. D., and Sanchez, J. E. Jr, J. Appl. Phys., 76 (3), 1563 (1994)Google Scholar
5. Besser, P. R., Marieb, T. N., and Bravman, J. C., Mat. Res. Soc. Symp. Proc., Vol. 309, 181 (1993)Google Scholar
6. Cahill, D. G. and Pohl, R. O., Phys. Rev. B, 35 (8), 4067 (1987)Google Scholar
7. Carslaw, H. S. and Jaeger, J. C., Conduction of Heat in Solids, Oxford University Press, Oxford, 1959 Google Scholar