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Epoxy/Aluminum Adhesion as Measured by Contact Mechanics (JKR) in the Presence of an Organic Contaminant

Published online by Cambridge University Press:  17 March 2011

Dara L. Woerdeman
Affiliation:
Department of Organic Materials, Sandia National Laboratories, Albuquerque, NM 87185-0958, USA
John A. Emerson
Affiliation:
Department of Chemical Engineering and Center for Bioelectronics, Biosensors and Biochips (C3B) Virginia Commonwealth University Richmond, VA 23284-3028
Rachel K. Giunta
Affiliation:
Department of Chemical Engineering and Center for Bioelectronics, Biosensors and Biochips (C3B) Virginia Commonwealth University Richmond, VA 23284-3028
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Abstract

The JKR contact mechanics approach is employed to analyze the effects of surface contaminants on adhesive bonding, as well as quantify the level of contamination at which adhesive strength decreases. The contact adhesive forces between two surfaces, one being a soft hemisphere and the other being a hard plate, can readily be determined by applying an external compressive load to join the two surfaces, subsequently applying a tensile load to assess the energy dissipation mechanisms involved in the debonding process. In the present work, we monitor the interactions between a diglycidyl epoxy elastomer and an aluminum oxide substrate in the presence of an organic contaminant. Furthermore, we present a method by which surface contamination can be quantified using a single number, referred to as the adhesion hysteresis parameter, H.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

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