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Epitaxy of Aluminium Films on Semiconductors by Ionized Cluster Beam

Published online by Cambridge University Press:  26 February 2011

I. Yamada ,
C. J. Palmstrøm ,
E. Kennedy ,
J. W. Mayer ,
H. Inokawa  and
T. Takagi
I. Yamada
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
C. J. Palmstrøm
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
E. Kennedy
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
J. W. Mayer
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
H. Inokawa
Affiliation:
Ion Beam Engineering Experimental Laboratory, Kyoto University, Sakyo, Kyoto 606, Japan
T. Takagi
Affiliation:
Ion Beam Engineering Experimental Laboratory, Kyoto University, Sakyo, Kyoto 606, Japan
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Abstract

Epitaxial Al films have been deposited onto the clean surface of single-crystal Si by ionized cluster beam (ICB) at room temperature. Thermal stability of the film has been examined by SEM, AES depth profiling, ion backscat. tering/channeling, and electrical characterization of the Al-Si interface. It was found that the ICB Al film on Si substrate was remarkably stable up to 550°C although pure Al was used. Alloy penetration at the interface, shift of barrier height, degradation of crystalline quality and development of annealing hillocks on the surface were not observed after the heat treatment. Extremely long electromigration life time was also confirmed. Epitaxial growth on GaAs(100) substrate was attempted and preliminary results are given.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 37: Symposium D – Layered Structures, Epitaxy, and Interfaces , 1984 , 401
Copyright
Copyright © Materials Research Society 1985

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References

1. Vossen, J.L., J. Vac. Sci. Technol. 19 761 (1981).Google Scholar
2. Learn, A.J., J. Electrochem. Soc. 123 894 (1976).10.1149/1.2132964Google Scholar
3. Poate, J.M., Tu, K.N., and Mayer, J W. (eds.), Thin Films-Interdiffusion and Reactions, (Wiley, NY, 1978).Google Scholar
4. Totta, P A. and Sopher, R.P., IBM J. Res. & Dev. 13 226 (1969).Google Scholar
5. Chaudhari, P., J. Appl. Phy. 45 4339 (1974).Google Scholar
6. Takagi, T., Yamada, I., Sasaki, A. J. Vac. Sci. Technol. A2 382 (1934)Google Scholar
7. Yamada, I., Takaoka, H., Inokawa, H., Usui, H., Cheng, S.C., and Takagi, T., Thin Solid Films 92 137 (1982).Google Scholar
8. Yamada, I., Saris, F.W., Takagi, T., Matsubara, K., Takaoka, H., and Ishiyama, S., Japn. J. appl. Phys. 19 L181 (1980).Google Scholar
9. Yamada, I., Inokawa, H., and Takagi, T., J. Appl. Phys. 56 2746 (1984).Google Scholar
10. Tabe, M., Arai, K., and Nakamura, H., Jpn. J. Appl. Phys. 20 703 (1981).Google Scholar
11. Hansen, M., Constitution of Binary Alloys, (McGraw-Hill, NY 1958).Google Scholar
12. Mori, M., IEEE Trans. Electron Devices ED–30 81(1983).Google Scholar
13. Card, H.C., in Metal Semiconductor Contacts, Conf. Ser. No. 22 129 (Institute of Physics, Manchester, England, 1974).Google Scholar
14. Reith, T.M. and Schick, J.D., Appl. Phys. Letters 25 524 (1974).10.1063/1.1655575Google Scholar
15. Cho, A.Y., Thin Solid Films 100 291 (1983).Google Scholar