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Epitaxial Thin Film Growth and Device Development in Monocrystalline Alpha and Beta Silicon Carbide

Published online by Cambridge University Press:  26 February 2011

Robert F. Davis
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Raleigh, NC 27695
J. W. Palmour
Affiliation:
Cree Research, Inc., Durham, NC 27713
J. A. Edmond
Affiliation:
Cree Research, Inc., Durham, NC 27713
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Abstract

High purity monocrystalline β-SiC films have been chemically vapor deposited on Si (100) and α-SiC (0001) by numerous groups around the world using SiH4 and C3H8 or C2H4 carried in H2. Films grown on nominal Si (100) contain substantial concentrations of dislocations, stacking faults and inversion domain boundaries; those deposited on α-SiC (0001) contain primarily double positioning boundaries. Both types of boundaries may be eliminated by using off-axis orientations of the respective substrates. However, the films grown on off-axis a substrates were the a(6H) polytype. Schottky diode, p-n junction, MESFET, MOSFET and HBT devices have been fabricated with encouraging results for future commercial applications. The barrier heights and ideality factors of Au Schottky diodes on β-SiC ranged from 0.9—1.15 eV and 1.2—1.6, respectively. However, the reverse leakage currents were much lower and the breakdown voltages considerably higher at all temperatures for the diodes on the α-SiC films. MESFETs fabricated using the diodes in the alpha films were superior to those in beta with the transconductance being more than 15 times greater in the former. Enhancement-and depletion-mode MOSFETs exhibited better behavior in terms of saturation, drain voltage and high temperature operation. All films produced on a-SiC substrates were superior to those produced in beta films grown on Si.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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