Skip to main content Accessibility help
×
Home

Energy-Free Bonding of Materials with Fine Controlled Surfaces in Ultrahigh Vacuum

  • Y. Kashib (a1), K. Machida (a1), T. Okuda (a1), W. Shimada (a1) and S. Nakata (a2)...

Abstract

Bonding phenomena with clean and smooth surfaces at room temperature (293 K) in ultrahigh vacuum has been studied. The metal surfaces, finished to required smoothness in nm level, were bombarded by Ar ions to remove surface contaminants. Then, two cleaned surfaces were put together. Interaction of silver and copper was examined by SEM, AES, and TEM. In order to observe the fundamental phenomena, bonding was attempted between a silver disk with a flat surface and a copper sphere 80 pm in diameter. A bonding area of about 40 μm2 was confirmed under slight load at 293 K. Strong bonds were achieved and the fracture took place almost completely in silver bulk. Furthermore, it was found that the bonding area obtained by the process was much larger than the one derived from conventional plastic theory.

Copyright

References

Hide All
1. Kobayashi, M., Hirota, J., Watanabe, N., and Machida, K., in Thin Films- Interfaces and Phenomena, edited by Nemanich, R.J., Ho, P.S., and Lau, S.S., ( Mater.Res.Soc. Proc. 54, 1986 ) pp.793798.
2. Munir, Z.A., Welding Journal, 62, 333s, (1983)
3. Buckley, D.H., ASTM Special Technical Publication, 431, 248, (1976)
4. Walker, Gilbert H. and Beverley Lewis, W., Metallu–ical Transactions 2, 2189, (1971)
5. Bowden, F.P. and Tabor, D., Friction and Lubrication of Solids, (Oxford University Press, London, 1950) ,pp.1014.

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed