Skip to main content Accessibility help
×
Home

Electromagnetic Induction Heating for the 70 nm Node

  • Keith Thompson (a1), John H. Booske (a1), R.F. Cooper (a1) and Y.B. Gianchandani (a2)

Abstract

Electromagnetic heating provides a novel alternative to “illumination-based” rapid thermal processing techniques. Exposure to radiation, in the RF and microwave frequency regimes, rapidly heats silicon (∼125°C/sec) to temperatures in excess of 1000°C without the use of a susceptor. These ramp rates make this technology suitable for the activation of shallow implanted dopants, and satisfaction of the 100 nm technology node has been achieved. Furthermore, the presence of high frequency electric fields creates ponderomotive forces that may alter the kinetics of dopant activation and diffusion. These additional driving forces could, once fully understood, lead to an enhanced activation mechanism that activates sufficient dopants to satisfy the 70 nm technology node at temperatures less than 1000°C.

Copyright

References

Hide All
1.www.sematech.org
2. Lerch, W., Bayha, B., Downey, D.F., Arevalo, E.A., “State of the art techniques for Ultra-Shallow junction Formation,” in Rapid Thermal and Other Short-Time Processing Technologies II, p. 321 of Proceedings of the 199th meeting of the Electrochemical Society, 25 March 2001, Washington DC.
3. Thompson, K., Booske, J. H., Cooper, R.F., Gianchandani, Y.B., Downey, D. F., “RF and Microwave Annealing for Ultra Shallow Junction Formation,” in Rapid Thermal and Other Short-Time Processing Technologies II, p. 121 of Proceedings of the 199th Meeting of the Electrochemical Society, 25 March 2001, Washington DC.
4. Booske, J.H., Cooper, R.F., Freeman, S.A., Rybakov, K. I., Semenov, V.E., ’Microwave ponderomotive forces in solid-state ionic plasmas,” Phys. Rev. B, vol. 55 p. 35593567. (1997)
5. Thompson, K., Gianchandani, Y.B., Booske, J.H., Cooper, R.F., “Direct Si-Si Bonding by Electromagnetic Induction Heating,” Journal of Micro-Electro-Mechanical Systems. Accepted for publication. (April 2002)
6. Thompson, K., Booske, J.H., Gianchandani, Y.B., Cooper, R.F., Bykov, Y., Eremeev, A., Plotnikov, I., “Electromagnetic Induction Heating for Cold Wall Rapid Thermal Processing,” in Proceedings of the 9th International Conference on RTP, IEEE, September 2001, Anchorage Alaska.
7. Downey, D.F., Falk, S. W., Marcus, S.D., Proc. of 7TH International Conference on Advanced Thermal Processing of Semiconductors. pp. 229236 (1999)
8 Tichy, R.S., Elliott, K., McCoy, S., Sing, D.C., “Annealing of Ultra-Shallow Implanted Junctions Using Arc-Lamp Technology: Achieving the 90 nm Node,” 9th International Conference on Advanced Thermal Processing of Semiconductors, IEEE RTP 2001, p. 82, Anchorage, Alaska. (2529 Sept. 2001)

Electromagnetic Induction Heating for the 70 nm Node

  • Keith Thompson (a1), John H. Booske (a1), R.F. Cooper (a1) and Y.B. Gianchandani (a2)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed