Skip to main content Accessibility help

Elastic Interconnects for Stretchable Electronic Circuits using MID (Moulded Interconnect Device) Technology

  • Dominique Brosteaux (a1), Fabrice Axisa (a2), Jan Vanfleteren (a3), Nadine Carchon (a4) and Mario Gonzalez (a5)...


An MID (Moulded Interconnect Device) technology was developed for the production of elastic electronic interconnections. The stretchability is obtained using tortuous horseshoe shaped metallic wiring, embedded in a matrix of PDMS (poly dimethyl siloxane). In this way stretchable interconnects have been realized, consisting of 4 micron thick gold wires, embedded in 250 − 500 μm thick silicone material. . Stretchable interconnections, realised with this technology, have a maximum stretchability above 100%, with a stable resistivity of about 1.5 Ω per running cm for a track width of 100μm. A first simple operating stretchable electronic circuit has been fabricated, consisting of a blue LED driven by stretchable wiring. The technology is under development for use in biomedical applications in the first place, but has potential to be extended for various other applications like smart textiles, robotic skins, etc.



Hide All
1. Gray, D. S., Tien, J., and Chen, C. S., “High-conductivity elastomeric electronics,” Adv. Mater., vol. 16, no. 5, pp. 393397, Mar. 2004.
2. Lacour, S.P., Jones, J., Wagner, S., Li, T., Zhigang, S., “Stretchable Interconnects for Elastic Electronic Surfaces”, Proceedings of IEEE, Vol. 93, N°. 8, august 2005.
3. Lacour, S.P., Jones, J., Wagner, S., “Design and Performance of Thin Metal Film Interconnects for Skin-Like Electronic Circuits”, IEEE Electron Device Letters, Vol. 25, N°4, April 2004
4. Maghribi, M.N., PhD Thesis LLNL, Preprint UCRL-LR-153347, 2003
5. Green, T.A., Liew, M.J., Roy, S., “Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications”, Journal of the electrochemical society, 150(3), C104–C110, 2003
6. Wong, C.P, “High Performance Screen Printable Silicone as Selective Hybrid IC Encapsulant”, IEEE Transactions on components, hybrids and manufacturing technology, Vol. 13, N°4, December 1990



Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed