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Effects of thermal annealing in the properties of PECVD a-SiC layers

Published online by Cambridge University Press:  17 March 2011

L.F. Marsal
Affiliation:
Departament d'Enginyeria Electrònica. Campus Nord, Av. Gran Capita s/n. Mòdul C4. Universitat Politècnica de Catalunya, Barcelona, Spain
J. Pallares
Affiliation:
Departament d'Enginyeria Electrònica. Campus Nord, Av. Gran Capita s/n. Mòdul C4. Universitat Politècnica de Catalunya, Barcelona, Spain
A. Orpella
Affiliation:
Departament d'Enginyeria Electrònica. Campus Nord, Av. Gran Capita s/n. Mòdul C4. Universitat Politècnica de Catalunya, Barcelona, Spain
D. Bardés
Affiliation:
Departament d'Enginyeria Electrònica. Campus Nord, Av. Gran Capita s/n. Mòdul C4. Universitat Politècnica de Catalunya, Barcelona, Spain
J. Puigdollers
Affiliation:
Departament d'Enginyeria Electrònica. Campus Nord, Av. Gran Capita s/n. Mòdul C4. Universitat Politècnica de Catalunya, Barcelona, Spain
R. Alcubilla
Affiliation:
Departament d'Enginyeria Electrònica.Universitat Rovira i Virgili, Tarragona, Spain
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Abstract

Effects of thermal annealing in the properties of PECVD amorphous-Si0.8C0.2:H layers were studied. In order to reduce the density defects and increase the electrical conductivity, some samples were annealed: at 500 °C during 1 hour followed by 15 minutes at 800 °C. The results show that in the course of the thermal process, the hydrogen diffuse outside the film and the annealed Si0.8C0.2:H films tend to segregate in silicon clusters and, as a result, partially crystallize. Electrical dark conductivity shows an increase in more than six orders of magnitude, while the optical bandgap decreases from 1.9 eV to 1.4 eV. Annealed- Si0.8C0.2 films have been used as emitter in silicon bipolar transistors. Results indicate promising features such as low base currents and good emitter Gummel numbers.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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