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Effects of Softbake Parameters on a Benzocyclobutene (BCB) Adhesive Wafer Bond

  • Daniel N. Pascual (a1)

Abstract

This study explores the effects of softbake parameters including temperature and duration on the homogeneity and toughness of a Benzocyclobutene (BCB) adhesive bond. Experiments were initially performed on silicon wafer pieces and then verified using quartered wafers bonded on a different machine. A four-point bend delamination test was employed to quantitatively measure interface toughness while uniformity was analyzed visually. A softbake temperature of 150 °C for 10 minutes yielded strong void-free bonds with an interface toughness of 23 J/m2.

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