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The Effects of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers

Published online by Cambridge University Press:  10 February 2011

J. M. Snodgrass ,
D. Pantelidis ,
J. C. Bravman  and
R. H. Dauskardt
J. M. Snodgrass
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
D. Pantelidis
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
J. C. Bravman
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
R. H. Dauskardt
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
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Abstract

The adhesion of thin film polymers will be critical in the integration of low-κ materials into microelectronic processing. This study describes the adhesion of two promising low-κ polymers (polyimide and benzocyclobutene) to a silicon dioxide surface. Critical adhesion values were measured using interface fracture mechanics samples in a double cantilever beam geometry. The effect of subcritical (time-dependent) delamination was also evaluated for these systems. Subcritical debonding data are important in understanding the effect of environment and temperature on interface reliability. To that end, experiments were conducted over a range of humidities to elucidate the effect of moisture on interface delamination. The important effect of the acceleration of debond growth rates due to cyclic loading is also described. In addition, XPS studies are presented to characterize the debond path in these layered systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 123
Copyright
Copyright © Materials Research Society 1999

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