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Effect of Laminates and Alloy Additions on Electromigration in AI Interconnects

  • E. M. Atakov (a1), A. Shepela (a1) and B. Miner (a1)

Abstract

The effect of solutes and refractory-metal laminates on the electromigration resistance of Al films is consistent with the effect of those variables on Al grain growth during deposition and/or post-patterning anneal.

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Effect of Laminates and Alloy Additions on Electromigration in AI Interconnects

  • E. M. Atakov (a1), A. Shepela (a1) and B. Miner (a1)

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