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Effect of Laminates and Alloy Additions on Electromigration in AI Interconnects

Published online by Cambridge University Press:  21 February 2011

E. M. Atakov ,
A. Shepela  and
B. Miner
E. M. Atakov
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
A. Shepela
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
B. Miner
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
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Abstract

The effect of solutes and refractory-metal laminates on the electromigration resistance of Al films is consistent with the effect of those variables on Al grain growth during deposition and/or post-patterning anneal.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 401
Copyright
Copyright © Materials Research Society 1993

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