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Early Morphological Changes in Al Lines During Current Stressing

Published online by Cambridge University Press:  10 February 2011

H. Schührer ,
H. Brückl  and
G. Reiss
H. Schührer
Affiliation:
Institute of Solid State and Materials Research Dresden, P.O. Box 270016 01171 Dresden, Germany
H. Brückl
Affiliation:
Institute of Solid State and Materials Research Dresden, P.O. Box 270016 01171 Dresden, Germany
G. Reiss
Affiliation:
Institute of Solid State and Materials Research Dresden, P.O. Box 270016 01171 Dresden, Germany
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Abstract

This paper will show that scanning force microscopy (also known as atomic force microscopy (AFM)) is a good tool to observe the microscopic changes in the morphology of metallic conductor lines during in situ current stressing with a very high spatial resolution. AFM was used to image AlSi1%Cu0.5% meander structures (1 μm thick, 4 μm wide, 44 mm long) at room temperature during current stressing. The microstructure of the material showed significant changes already at a current density of 1.5 MA/cm2, still before voiding and hillock growth occurred. Growth and reduction of the grain sizes and also grooving and widening of the grain boundaries were observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 363
Copyright
Copyright © Materials Research Society 1997

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References

1 Baldini, G. L., de Munari, I., Scorzoni, A. and Fantini, F. Microelectron. Reliab. 33 1779 (1993)Google Scholar
2 Levine, L. E., Reiss, G. and Smith, D. A., J. Appl. Phys. 74, 5476 (1993 Google Scholar