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Direct Metal Nano-patterning Using Embossed Solid Electrolyte

Published online by Cambridge University Press:  31 January 2011

Anil Kumar
Affiliation:
anilku2@uiuc.edu, University of Illinois at Urbana-Champaign, ECE, 2225, MNTL, 208 N Wright St, Urbana, Illinois, 61801, United States
Keng Hsu
Affiliation:
khsu5@illinois.edu, University of Illinois at Urbana-Champaign, MSE, Urbana, Illinois, United States
Kyle Jacobs
Affiliation:
kjacobs5@illinois.edu, University of Illinois at Urbana-Champaign, MSE, Urbana, Illinois, United States
Placid Ferreira
Affiliation:
pferreir@uiuc.edu, University of Illinois at Urbana-Champaign, MSE, Urbana, Illinois, United States
Nicholas Fang
Affiliation:
nicfang@illinois.edu, University of Illinois at Urbana-Champaign, MSE, Urbana, Illinois, United States
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Abstract

The recent growth in optoelectronics, nanoelectronics, nanooptics, and chemical and biological sensing has been fueled by the ability to fabricate nanostructures with ever smaller features. However, several significant constraints still remain in terms of cost, limited pattern size, processing conditions, pattern flexibility, and so on. Fabrication of features as small as 50 nm at ambient conditions with high pattern flexibility and low cost remains a serious challenge. Here we report a new solid-state electrochemical imprinting process that is carried out at ambient conditions, requires nominal pressure and very low electric potential, eliminates any liquid electrolytes, shows very high reproducibility, and promises the capability to scale up for large area patterning while retaining a significant cost advantage. Through combination of the best merits of nanoimprint lithography, micro forming, and the solid-state electrochemical imprinting technique, S4, (recently introduced by Hsu et al., Nano Lett., 2007, 7, 446; and Schultz et al., J. Vac. Sci. Techol. B, 2007, 25, 2419), we show a very high pattern flexibility to create nano-scale metallic features.

As a first step, we use a micro-forming-like embossing process to engrave nano-scale features onto a solid electrolyte tool surface using an e-beam fabricated Si mold. Silver sulfide, Ag2S, is used as a solid electrolyte because of its favorable mechanical properties for micro forming and its excellent electrochemical properties. This ionic compound is ductile and has a relatively low yield stress at 80MPa. Followed by embossing, the patterned solid electrolyte surface is then used to carry out the S4 process, creating a negative image on a metallic substrate. This process eliminates the costly Focused Ion Beam milling used by Hsu et al. to create features on the electrolyte tool. It is also highly favorable for large-area patterning as well as mass-production of metallic substrates restricted only by the capability to fabricate the mold at first step. The embossed solid-electrolyte tool surface can be easily trimmed off with a microtome; the tool can then be re-used for embossing and patterning metallic substrates.

Using this process we demonstrate the ability to fabricate silver nanostructures with features <15 nm. Such small features are critical in metal nanostructures for field enhancement that finds applications in SERS and other biological and chemical sensing. So far, a line edge roughness of <10 nm is observed which is significant in the sense that silver is highly mobile and has the tendency to granulate. Finally, we show how this methodology has the capability to fabricate large area patterns at low cost and ambient conditions. As a proof of concept, we demonstrate the ability to fabricate areas >30 sq. mm. Such large scale fabrication is highly desired for applications like biomimetics and patterning for superhydrophobic surfaces.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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