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Diode Laser-Assisted Deposition of Gold and Copper from Thin Organometallic Films

Published online by Cambridge University Press:  15 February 2011

Stephane Evoy ,
Marie-Hélène Bernier ,
Ricardo Izquierdo ,
Fabrice Pieri ,
Michel Meunier  and
Edward Sacher
Stephane Evoy
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
Marie-Hélène Bernier
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
Ricardo Izquierdo
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
Fabrice Pieri
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
Michel Meunier
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
Edward Sacher
Affiliation:
Groupe des Couches Minces and Département de Génie Physique, École Polytechnique de Montréal, P.O. Box 6079, Station “Centre-ville”, Montrdal, P.Q., H3C 3A7, Canada.
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Abstract

We have developed a simple, compact and economical diode laser-assisted process for the direct writing of gold and copper on polyimide. Gold precursor films were deposited by spin-coating a commercially available organometallic compound onto the substrate. The local pyrolysis of these films was induced by the focused beam of an AlGaAs diode laser array ( Pmax = 1 W, λ = 796 nm). Direct writing was achieved in open air while moving the substrate at speeds up to 15 mm/s. Gold lines 13–17 μm wide, ∼0.1 μm thick, and having a resistivity of 30 μΩ·cm, were obtained on polyimide with good reproducibility using writing speeds > 10 mm/s. Following a simple annealing process, these gold lines successfully activated the electroless plating of copper. After 45 min of plating, 2 μm thick Cu/Au conductors, having a resistivity of 8 μΩ·cm, were deposited. A commercially available copper precursor was also studied for the direct deposition of copper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 91
Copyright
Copyright © Materials Research Society 1994

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