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Diamond Heat Sinks For High Temperature Electronics: Simuilation, And Thermal Analysis

Published online by Cambridge University Press:  10 February 2011

Nickolaos Strifas  and
Aris Christou
Nickolaos Strifas
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405-5208(301) 314-2029
Aris Christou
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405-5208(301) 314-2029
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Abstract

performance that can be achieved by utilizing a diamond heat - sink design which minimizes junction - to - case thermal resistance. Effects of the thermal conductivity of the substrate material, the thermal conductivity of the die attach material, the substrate thickness, and the die attach thickness onl Ihe thermal resistance are addressed. The results indicate that the temperature increase could be 3 to 4 times less with diamond heat-sinks when compared to other materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 416: Symposium DD – Diamond for Electronic Applications , 1995 , 101
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCES

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