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Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film

  • Ming-Tzer Lin (a1), Chi-Jia Tong (a2) and Chung-Hsun Chiang (a3)

Abstract

A novel design electroplating spring frame structure specimen is demonstrated here. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on submicron scale freestanding thin films.

Certain thin films applicable in CMOS interconnect and low K materials were tested including sputtered Copper, Tantalum Nitride thin films. Metal specimens were fabricated by sputtering. For Tantalum Nitride film samples, Nitrogen gas was introduced into the chamber during sputtering Tantalum films on the silicon wafer.

We found the modulus of Copper and Tantalum Nitride thin films thin films with thickness of 200 to 800nm at room temperature.

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Keywords

Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film

  • Ming-Tzer Lin (a1), Chi-Jia Tong (a2) and Chung-Hsun Chiang (a3)

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