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Dependence of Hardness on Modulation Amplitude in Compositionally Modulated Cu-Ni Thin Films

Published online by Cambridge University Press:  21 February 2011

R.R. Oberle  and
R.C. Cammarata
R.R. Oberle
Affiliation:
Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD 21218-2689, U.S.A.
R.C. Cammarata
Affiliation:
Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD 21218-2689, U.S.A.
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Abstract

The hardness dependence on the composition modulation amplitude of electrodeposited Cu-Ni multilayered thin films was investigated. The composition modulation amplitude was reduced by annealing the films, resulting in interdiffusion between the Cu and Ni layers. The hardness enhancement ΔH over that for a completely intermixed film was measured as a function of composition modulation amplitude A. It was found that for films with a sine wave composition profile, the hardness enhancement ΔH varied as A1.1±0.1, in good agreement with the model given by Krzanowski [1].

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 369
Copyright
Copyright © Materials Research Society 1995

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References

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