- Cited by 17
Kang, S. K. and Woychik, C. G. 1987. Diffusional Processes in Metallurgical Interconnections. MRS Proceedings, Vol. 108, Issue. ,
Reiley, Timothy C. and Shih, Da-Yuan 1989. Microelectronics Packaging Handbook. p. 779.
Chason, M. and Hong, J. 1989. Kinetic interactions of copper, lead and tin on solder coated PC boards studied using X-ray diffraction. p. 294.
Bi-Shio Chiou Liu, K.C. Jeng-Gong Duh and Palanisamy, P.S. 1990. Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, Issue. 2, p. 267.
Chan, Chin-Jong Chang, Jei-Wei and Chin, Leo A. 1992. Formation Kinetics and Thin Film Stress of Tin Containing Intermetallic Compounds. MRS Proceedings, Vol. 264, Issue. ,
Pinizzotto, R.F. Jacobs, E.G. Wu, Y. Sees, J.A. Foster, L.A. and Pouraghabagher, C. 1993. The dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders. p. 209.
Stromswold, E. I. Pratt, R. E. and Quesnel, D. J. 1993. Capillary soldering system for the material property characterization of solder joints. Review of Scientific Instruments, Vol. 64, Issue. 11, p. 3314.
Wu, Yujing Sees, Jennifer A. Pouraghabagher, Cyrus Foster, L. Ann Marshall, James L. Jacobs, Elizabeth G. and Pinizzotto, Russell F. 1993. The formation and growth of intermetallics in composite solder. Journal of Electronic Materials, Vol. 22, Issue. 7, p. 769.
Chiou, Bi-Shiou Chang, Jiann-Haur and Duh, Jenq-Gong 1995. Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate. Journal of Materials Science: Materials in Electronics, Vol. 6, Issue. 6, p. 375.
Yeo, C.K. Mhaisalkar, S. and Pang, H.L.J. 1996. Solder joint reliability study of 256 pin, 0.4 mm pitch, PQFP. p. 1222.
Pratt, R.E. Stromswold, E.I. and Quesnel, D.J. 1996. Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 19, Issue. 1, p. 134.
Abtew, Mulugeta and Selvaduray, Guna 2000. Lead-free Solders in Microelectronics. Materials Science and Engineering: R: Reports, Vol. 27, Issue. 5-6, p. 95.
Sommadossi, S Gust, W and Mittemeijer, E.J 2003. Characterization of the reaction process in diffusion-soldered Cu/In–48 at.% Sn/Cu joints. Materials Chemistry and Physics, Vol. 77, Issue. 3, p. 924.
Egli, A. Wan Zhang and Schwager, F. 2003. New approaches to whisker free tin deposits. p. 55.
Wu, C.M.L. Yu, D.Q. Law, C.M.T. and Wang, L. 2004. Properties of lead-free solder alloys with rare earth element additions. Materials Science and Engineering: R: Reports, Vol. 44, Issue. 1, p. 1.
Wan Zhang Egli, A. Schwager, F. and Brown, N. 2005. Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation. IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, Issue. 1, p. 85.
Niranjani, V. L. Venkateswarlu, Pamidi Singh, Vajinder Chandra Rao, B. S. S. and Kamat, S. V. 2018. Effect of Gold Addition on the Microstructure and Mechanical Properties of Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy. Transactions of the Indian Institute of Metals, Vol. 71, Issue. 6, p. 1497.
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The growth of intermetallic compounds and the strength of Cu/ Sn and Cu/ 60Sn40Pb butt joints were studied as a function of isothermal aging. The effects of single-crystal (100), (110), and (111) oriented copper on the growth rates of Cu3Sn and Cu6Sn5 intermetallic compounds are characterized and the influence of elevated temperature aging on the tensile strength of butt joints analyzed. Substrate orientation appears to influence the growth rate. Metallographic measurements showed that the intermetallic compounds grew at a rate proportional to the square root of time. Tensile tests of aged butt joints revealed a more complex time dependence.
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