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Degradation of Fracture and Fatigue Properties of MEMS Structures Under Cyclic Loading

Published online by Cambridge University Press:  01 February 2011

Jong-Jin Kim
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Dongil Kwon
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
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Abstract

The fracture and fatigue properties of LIGA nickel MEMS structures were evaluated by microtensile and fatigue test methods. A microtensile/fatigue device was developed and specimens with feature size ten micrometers were used. The fatigue property was derived from displacement amplitude – the number of cycles to failure curve by applying a dynamic load with a piezoelectric actuator. The tensile/fracture properties after various cyclic loading were also measured. Both fatigue and tensile test results showed a cyclic softening phenomenon.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

1. Kraft, O., Freund, L. B., Phillips, R., Arzt, A., MRS Bulletin 27, 30. (2002).Google Scholar
2. Hong, S. and Weil, R., Thin Solid Films 283, 175. (1996).Google Scholar
3. Read, D. T., Int. J. Fatigue 20, 203. (1998).Google Scholar
4. Cornella, G., Vinci, R. P., Iyer, R. S., Dauskardt, R. H., and Bravman, J. C., in: Brown, S.B., Muhlstein, C., Krulevitch, P., Johnston, G.C., Howe, R.T., Gilbert, J.R. (Eds.), Microelectromechanical Structures for Materials Research, San Francisco, CA, U.S.A., April 13-17, 1998, Materials Research Society Symposium Proceeding 518 (1998) 81.Google Scholar
5. Barbosa, N. B. III, El-Deiry, P., and Vinci, R. P., in: Corcoran, S. G., Joo, Y.C., Moody, N. R., and Suo, Z. (Eds.), Thin Films-Stresses and Mechanical Properties X, Boston, MA, U.S.A., December 1-5, 2003, Materials Research Society Symposium Proceeding 795 (2004) U11.39.Google Scholar
6. Mazza, E., Abel, S., and Dual, J., Microsyst. Tech. 2(4), 197 (1996).Google Scholar
7. Dual, J., Mazza, E., Schiltges, G., and Schlums, D., in: Friedrich, C.R., Umeda, A. (Eds.), Micromachining and Microfabrication, Austin, TX, U.S.A., September 29-30, 1997, Proceedings of SPIE 3225 (1997) 12.Google Scholar
8. Sharpe, W. N. Jr, LaVan, D. A., and Edwards, R. L., IEEE 1997 International Conference on Solid-state Sensors and Actuators, Chicago, IL, U.S.A., June 16-19, 1997, Proceedings of Transducers' 97 (1997) 607.Google Scholar
9. Sharpe, W. N. Jr, LaVan, D. A., and McAleavey, A., Micro-Electro-Mechanical Systems (MEMS), ASME DSC, 62/HTD, 354, 93. (1997).Google Scholar
10. Sharpe, W. N. Jr and McAleavey, A., in: Friedrich, C. R., Vladimirsky, Y. (Eds.), Micromachining and Microfabrication, Santa Clara, CA, U.S.A., September 20-22, 1998, Proceedings of SPIE 3512 (1998) 130.Google Scholar
11. Christenson, T. R., Buchheit, T. E., Schinale, D. T., and Bourcier, R. J., in: Brown, S. B., Muhlstein, C., Krulevitch, P., Johnston, G. C., Howe, R. T., Gilbert, J. R. (Eds.), Microelectromechanical Structures for Materials Research, San Francisco, CA, U.S.A., April 13-17, 1998, Materials Research Society Symposium Proceeding 518 (1998) 185.Google Scholar
12. Hemker, K. J. and Last, H., Mat. Sci. Eng. A319–321, 882. (2001).Google Scholar
13. Larsen, K. P., Rassmussen, A. A., Ravnkilde, J. T., Ginnerup, M., and Hansen, O., Sens. Actuators A 103, 156. (2003).Google Scholar
14. Cho, H. S., Hemker, K. J., Lian, K., Goettert, J., and Dirras, G., Sens. Actuators A 103, 59. (2003).Google Scholar
15. Boyce, B. L., Michael, J. R., and Kotula, P. G., Acta Mater. 52, 1609. (2004).Google Scholar
16. Allameh, S. M., Lou, J., Kavishe, F., Buchheit, T., and Soboyejo, W. O., Mat. Sci. Eng. A371, 256. (2004).Google Scholar
17. Kim, D. W. and Kwon, D., InModern, t. J. Physics B17, 1534. (2003).Google Scholar
18. Chasiotis, I. and Knauss, W. G., in: Vladimirsky, Y., Coane, P. J. (Eds.), Micromachining and Microfabrication, Santa Clara, CA, U.S.A., September 17-20, 2000, Proceedings of SPIE 4175 (2000) 96.Google Scholar
19. Hertzberg, R. W., Deformation and fracture mechanics of engineering materials, Third edition (John Wiley & Sons, 1989), 489.Google Scholar
20. Dowling, N. E., Mechanical Behavior of Materials, Second edition (Prentice Hall, New Jersey, 1999), 586.Google Scholar