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The Deformation Microstructure in NI3Si Polycrystals Strained Over the Range of Temperature of Flow Stress Anomaly

Published online by Cambridge University Press:  26 February 2011

B. Tounsia
Affiliation:
Laboratoire de Métallurgie Physique, Faculté des Sciences, 40 Avenue du Recteur Pineau, 86022 Poitiers, France.
P. Beauchamp
Affiliation:
Laboratoire de Métallurgie Physique, Faculté des Sciences, 40 Avenue du Recteur Pineau, 86022 Poitiers, France.
Y. Mishima
Affiliation:
Research Laboratory of Precision Machinery and Electronics, Tokyo Institute of Technology, Nagatsuta, Midori-Ku, Yokohama 227, Japan.
T. Suzuki
Affiliation:
Research Laboratory of Precision Machinery and Electronics, Tokyo Institute of Technology, Nagatsuta, Midori-Ku, Yokohama 227, Japan.
P. Veysslière
Affiliation:
LEM, CNRS-ONERA, B.P. 72,92322 Châtillon Cedex. France.
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Abstract

In order to correlate the flow stress anomaly of Ni3Si with dislocation properties, a weakbeam study ofpolycrystalline samples deformed between ambient and the peak temperature was carried out. Samples with two extreme Ni/Si ratios were tested.The most frequently activated slip system changes progressively from octahedral to cubic with increasing temperature. The transformation of superdislocations into Kear-Wilsdorf configurations gives rise to screw dislocations that are rectilinear only after deformation at room temperature. The effect of temperature is to gradually promote bending of Kear-Wisdorf configurations in the cube plane, from a few nanometers at 230°C to several tenths of micrometers at intermediate temperature. Cube slip begins to be massively activated a little below the peak temperature. It is suggested that the flow stress anomaly is controlled by progressive exhaustion of octahedral slip by thermally-activated expansion of superdislocations on the cube cross-slip plane.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

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