Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-06-27T01:11:19.071Z Has data issue: false hasContentIssue false
  • English
  • Français

Deformation Behavior of SiC Whisker Reinforced Si3N4

Published online by Cambridge University Press:  25 February 2011

R. D. Nixon ,
S. Chevacharoenkul ,
M. L. Huckabee ,
S. T. Buljan  and
R. F. Davis
R. D. Nixon
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Box 7907, Raleigh, NC 27695, U.S.A.
S. Chevacharoenkul
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Box 7907, Raleigh, NC 27695, U.S.A.
M. L. Huckabee
Affiliation:
GTE Laboratories, Waltham, MA U.S.A.
S. T. Buljan
Affiliation:
GTE Laboratories, Waltham, MA U.S.A.
R. F. Davis
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Box 7907, Raleigh, NC 27695, U.S.A.
Get access

Abstract

Constant compressive stress creep exp∼riments in jhe temperature and stress ranges of 1420K – 1570K and 50 MN/m2 –350 MN/m2 have been conducted on hot pressed unreinforced Si3N4 containing the densification aids of 6 wt% Y2O3 and 1.5 wt% Al2O3 and on a similarly prepared composite material reinforced with 20 vol% SiC whiskers. Steady-state creep data obtained on these materials in a N2 atmosphere gave stress exponent values of 1.2 – 1.6 and 0.4 – 1.6 for the unreinforced Si3N4 and the composite, respectively. A break in the steady-state creep rate vs. log stress observed only in the composite occurred at approximately 250 MN/m2 at the temperatures of 1520K and 1570K. This information coupled with the results of electron microscopy indicate that the temperature as well as the extensive crystallization (or lack of it) of the amorphous grain boundary phase are the principal factors controlling the deformation rate at a given stress within the limits of the small total strains achieved in this research.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 78: Symposium E – Advances in Structural Ceramics , 1986 , 295
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Becher, P.F., Wei, G.C., J. Am. Ceram. Soc. 67, C267 (1984).CrossRefGoogle Scholar
2. Wei, G.C. and Becher, P.F., Am. Ceram. Soc. Bull. 64, 298 (1985).Google Scholar
3. Nutt, S.R., Private communication.Google Scholar
4. Nutt, S.R., J. Am. Ceram. Soc. 67, 428 (1984).Google Scholar
5. Sharma, N.K., Williams, W.S. and Zangvil, A., J. Am. Ceram. Soc. 67, 715 (1984).CrossRefGoogle Scholar
6. Carter, C.H. Jr, Stone, C.A., Davis, R.F. and Schaub, D.R., Rev. Sci. Instrum. 51, 1352 (1980).Google Scholar
7. Carter, C.H. Jr, and Davis, R.F., J. Am. Ceram. Soc. 67, 409 (1984).Google Scholar
8. Krivanek, O.L., Shaw, T.M. and Thomas, G., J. Am. Ceram. Soc. 62, 585 (1979).CrossRefGoogle Scholar
9. Ahn, C.C. and Thomas, G., J. Am. Ceram. Soc. 16, 14 (1983).CrossRefGoogle Scholar