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Cu-Nanoclusters Produced on AuCu-Alloys with an Electrochemical Scanning Tunneling Microscope

Published online by Cambridge University Press:  17 March 2011

S. Maupai ,
A.S. Dakkouri ,
M. Stratmann  and
P. Schmuki
S. Maupai
Affiliation:
University of Erlangen-Nuremberg, Department of Materials Science, Chair for Surface Science and Corrosion (LKO), Martensstraße 7, D-91058 Erlangen, Germany
A.S. Dakkouri
Affiliation:
University of Erlangen-Nuremberg, Department of Materials Science, Chair for Surface Science and Corrosion (LKO), Martensstraße 7, D-91058 Erlangen, Germany
M. Stratmann
Affiliation:
Max Planck Institute for Iron Research, Department of Interface chemistry and Surface Engineering, Max Planck Str. 1, D-40237 Düsseldorf, Germany
P. Schmuki
Affiliation:
University of Erlangen-Nuremberg, Department of Materials Science, Chair for Surface Science and Corrosion (LKO), Martensstraße 7, D-91058 Erlangen, Germany
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Abstract

Cu-nanoclusters can be produced in an electrochemical environment by tip-induced metal deposition using an electrochemical scanning tunneling microscope (EC-STM). These clusters, consisting of 100-1000 atoms only, show a surprising stability against anodic oxidation. The clusters, which are 2-3 atomic layers in height dissolve slowly when the applied potential is increased step by step to 200 mV positive of the reversible Nernst potential for “normal” copper dissolution. The presented work gives evidence that the unusual stability of the clusters could be a consequence of interfacial alloying between the cluster and the underlying substrate. In order to study these effects Cu-nanoclusters have been produced on pure gold substrates and on carefully prepared Au3Cu(111)-substrates. This work compares the results obtained on both substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 704: Symposium W – Nanoparticulate Materials , 2001 , W5.8.1
Copyright
Copyright © Materials Research Society 2002

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