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Cubic AlGaN/GaN Hetero-Field Effect Transistors with Normally On and Normally Off Operation

Published online by Cambridge University Press:  31 January 2011

Donat J. As
Affiliation:
d.as@uni-paderborn.de, University of Paderborn, Department of Physics, Paderborn, Germany
Elena Tschumak
Affiliation:
elena.tschumak@uni-paderborn.de, University of Paderborn, Department of Physics, Paderborn, NRW, Germany
Florentina Niebelschüetz
Affiliation:
florentina.niebelschuetz@tu-ilmenau.de, TU Ilmenau, FG Nanotechnologie, Ilmenau, Thueringen, Germany
W. Jatal
Affiliation:
w.jatal@tu-ilmenau.de, TU Ilmenau, FG Nanotechnologie, Ilmenau, Thueringen, Germany
Joerg Pezoldt
Affiliation:
joerg.pezoldt@tu-ilmenau.de, TU Ilmenau, FG Nanotechnologie, Ilmenau, Thueringen, Germany
Ralf Granzner
Affiliation:
ralf.granzner@tu-ilmenau.de, TU Ilmenau, FG Festkörperelektronik, Ilmenau, Thueringen, Germany
Frank Schwierz
Affiliation:
frank.schwierz@tu-ilmenau.de, TU Ilmenau, FG Festkörperelektronik, Ilmenau, Thueringen, Germany
Klaus Lischka
Affiliation:
lischka@upb.de, University of Paderborn, Department of Physics, Paderborn, NRW, Germany
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Abstract

Non-polar cubic AlGaN/GaN HFETs were grown by plasma assisted MBE on 3C-SiC substrates. Both normally-on and normally-off HFETs were fabricated using contact lithography. Our devices have a gate length of 2 μm, a gate width of 25 μm, and source-to-drain spacing of 8 μm. For the source and drain contacts the Al0.36Ga0.64N top layer was removed by reactive ion etching (RIE) with SiCl4 and Ti/Al/Ni/Au ohmic contacts were thermally evaporated. The gate metal was Pd/Ni/Au. At room temperature the DC-characteristics clearly demonstrate enhancement and depletion mode operation with threshold voltages of +0.7 V and −8.0 V, respectively. A transconductance of about 5 mS/mm was measured at a drain source voltage of 10 V for our cubic AlGaN/GaN HFETs, which is comparable to that observed in non-polar a-plane devices. From capacity voltage measurements a 2D carrier concentration of about 7×1012 cm-2 is estimated. The influence of source and drain contact resistance, leakage current through the gate contact and parallel conductivity in the underlaying GaN buffer are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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