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Critical Materials, Device Design, Performance and Reliability Issues in 4H-SiC Power Umosfet Structures

  • A. K. Agarwal (a1), R. R. Siergiej (a1), S. Seshadri (a1), M. H. White (a2), P. G. McMullin (a1), A. A. Burk (a1), L. B. Rowland (a1), C. D. Brandt (a1) and R. H. Hopkins (a1)...

Abstract

The long-term reliability of gate insulator under high field stress of either polarity presents a constraint on the highest electric field that can be tolerated in a 4H-SiC UMOSFET under on or off condition. A realistic performance projection of 41H-SiC UMOSFET structures based on electric field in the gate insulator (1.5 MV/cm under on-condition and 3 MV/cm under offcondition) consistent with long-term reliability of insulator is provided for the breakdown voltage in the range of 600 to 1500 V. The use of P+ polysilicon gate allows us to use a higher field of 3 MV/cm in the insulator under off-condition and leads to a higher breakdown voltage as the Fowler Nordheim (FN) injection from the gate electrode is reduced. FN injection data is presented for p type 4H-SiC MOS capacitor under inversion at room temperature and at 325°C. It is concluded that the insulator reliability, and not the SiC, is the limiting factor and therefore the high temperature operation of these devices may not be practical.

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References

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Critical Materials, Device Design, Performance and Reliability Issues in 4H-SiC Power Umosfet Structures

  • A. K. Agarwal (a1), R. R. Siergiej (a1), S. Seshadri (a1), M. H. White (a2), P. G. McMullin (a1), A. A. Burk (a1), L. B. Rowland (a1), C. D. Brandt (a1) and R. H. Hopkins (a1)...

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