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Cracking in Thin Films and Substrates

Published online by Cambridge University Press:  22 February 2011

P. Ståhle  and
C. F. Shih
P. Ståhle
Affiliation:
Department of Technology, Uppsala University, Uppsala, Sweden
C. F. Shih
Affiliation:
Division of Engineering, Brown University, Providence, RI, USA
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Abstract

A crack terminating perpendicularly at the bimaterial interface is analyzed. Stress distributions for a broad range of elastic moduli and yield strength mismatch are discussed. These results can be used to understand the effect of mechanical properties mismatch on the competition between crack deflecting into the interface and crack penetrating into the base material. The role of microdefects near the interface is explored.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 567
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

[1] Johansson, S., Ericson, F. and Schweitz, J.-Å., Journal of Applied Physics, 65, 122(1988).CrossRefGoogle Scholar
[2] Zak, A. R. and Willams, M. L., Journal of Applied Mechanics, 30, 142(1963).CrossRefGoogle Scholar
[3] Stahle, P. and Shih, C. F., “Elastic-plastic analysis of a crack terminating at a bi-material interface.” To appear in Journal of the Mechanical Behavior of Materials. Google Scholar
[4] O'Dowd, N. P. and Shih, C. F., Journal of the Mechanics and Physics of Solids, 39, 989(1991).CrossRefGoogle Scholar