Skip to main content Accessibility help
×
Home

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

  • A. Sekiguchi (a1), J. Koike (a1), K. Ueoka (a2), J. Ye (a2), H. Okamura (a3), N. Otsuka (a3), S. Ogawa (a3) and K. Maruyama (a1)...

Abstract

Adhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

Copyright

References

Hide All
1. Bagchi, A., and Evans, A., Thin Solid Films, 286, 203 (1996).
2. Kriese, M.D., Moody, N. R., andGerberich, W.W., Acta Mater, 46, 6623 (1998).
3. Lane, M., and Dauskardt, R. H., J Mater Res 15, 203 (2000).
4. Lane, M., and Vainchtein, A., Gao, H., and Dauskardt, R.H., J Mater Res, 15, 2758 (2000).
5. Lane, M.W., Snodgrass, J. M., and Dauskardt, R. H., Microelectronic Reliability, 41, 1615 (2001).
6. Holloway, K., and Fryer, P. M., Appl. Phys. Lett, 57, 1736 (1990).
7. Hieber, K., and Mayer, N. M., Thin Solid Film, 90, 43 (1982).
8. Schwartz, N., and Feit, E. D., J. Electrochem. Soc, 124, 123 (1997).
9. Thornton, J. A., and Hoffman, D.W., J. Vac. Sci. Technol, 19, 164 (1977).
10. Jankowski, A. F., Bionta, A. F., and Gabriele, R.M., J. Vac. Sci. Technol, A7, 210 (1989).
11. Schonberg, N., Acta Chem Scandinarica, 8, 199 (1954).
12. Terao, N., J. J. Appl. Phys, 10, 248 (1971).
13.JCPDS No.25-1278, No.25-1280,. No.39-1485, No.49-1283.
14. Sekiguchi, A., Koike, J., and Maruyama, K., to be published.

Related content

Powered by UNSILO

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

  • A. Sekiguchi (a1), J. Koike (a1), K. Ueoka (a2), J. Ye (a2), H. Okamura (a3), N. Otsuka (a3), S. Ogawa (a3) and K. Maruyama (a1)...

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed.