Hostname: page-component-76fb5796d-5g6vh Total loading time: 0 Render date: 2024-04-26T12:48:15.381Z Has data issue: false hasContentIssue false
  • English
  • Français

The Control Of Intrinsic Stresses In Cvd Diamond Films With Multistep Processing

Published online by Cambridge University Press:  10 February 2011

S. Nijhawan ,
S. M. Jankovsky  and
B. W. Sheldon
S. Nijhawan
Affiliation:
Division of Engineering, Brown University, Providence, RI 02906
S. M. Jankovsky
Affiliation:
Division of Engineering, Brown University, Providence, RI 02906
B. W. Sheldon
Affiliation:
Division of Engineering, Brown University, Providence, RI 02906
Get access

Abstract

The role of intrinsic stresses in diamond films is examined. The films were deposited on (100) Si substrates by microwave plasma-enhanced chemical vapor deposition. The total internal stresses (thermal and intrinsic) were measured at room temperature with the bending plate method. The thermal stresses are compressive and arise due to the mismatch in thermal expansion coefficient of film and substrate. The intinsic stresses were tensile and evolved during the deposition process. These stresses increased with increasing deposition time. A 12 hour intermediate annealing treatment was found to reduce the tensile stresses considerably. The annealing treatment is most effective when the diamond crystallites are undergoing impingement and coalescence. This is consistent with the theory that the maximum tensile stresses are associated with grain boundary energetics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 416: Symposium DD – Diamond for Electronic Applications , 1995 , 163
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Windischmann, H. and Epps, G., J. Appl. Physics 69 p. 2231 (1991).Google Scholar
2. Angus, J., Hayman, C., and Hoffman, R., SPIR Proc. 969, p. 2 (1988).Google Scholar
3. Windischmann, H., collins, R. and Cavese, M., J. Non-Cryst. Solids 85, p. 261 (1986).Google Scholar
4. Schwarzbach, D., Haubner, R. and Lux, B., Diamond Relat. Mater. 3, p. 757 (1994).Google Scholar
5. Schafer, L., Jiang, X. and Klages, C., Applications of Applications of Diamond and Related Materials p. 121 (1991).Google Scholar
6. Baglio, J., Farnsworth, B., Hankin, S., Hamill, G. and O'Neil, D., Thin Solid Films 212, p. 180 (1992)Google Scholar
7. Doemer, M. and Nix, W., CRC Critical Reviews in Solid State and Materials Science 14, p. 225 (1988).Google Scholar
8. Hoffman, R., Surf. interface, Anal. 3, p. 62 (1981).Google Scholar
9. Fallon, P. and Brown, L., Diamond Relat. Mater. 2, p. 1004 (1993)Google Scholar