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Continuous YBCO – Tape Coating by Thermal Evaporation

Published online by Cambridge University Press:  18 March 2011

Ralf Nemetschek
Affiliation:
THEVA GmbH, Eching-Dietersheim, Germany
Werner Prusseit
Affiliation:
THEVA GmbH, Eching-Dietersheim, Germany
B. Holzapfel
Affiliation:
IFW Dresden, Germany
J. Eickemeyer
Affiliation:
IFW Dresden, Germany
B. deBoer
Affiliation:
IFW Dresden, Germany
U. Miller
Affiliation:
Plansee AG, Reutte, Austria
E. Maher
Affiliation:
Oxford Superconductivity plc, UK
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Abstract

Currently, due to simultaneous large area coating thermal evaporation (TE) allows the highest YBa2Cu3O7 (YBCO) volume deposition rates among various coating techniques. The simultaneous large area deposition translates into long length when the deposition area is closely filled up with metal tape. On short RABiTS samples thermal evaporation has already established critical current densities in excess of 1 MA/cm2 at 77K. Recently, the deposition technique has been scaled up using a multi-turn tape winder for a simultaneously coatable length of 4 meters of 1 cm wide tape. The reel to reel tape deposition system is designed for long term operation based on a vapor composition control by atomic absorption spectroscopy and in situ refillable evaporation sources. In the initial setup phase the system has been able to reproduce the above results on small samples. The first results on continuously moving tape substrate coating up to a length of several meters will be reported.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1. Goyal, A. et al., Appl. Phys. Letters 69, 1795 (1996)Google Scholar
2. Norton, D.P. et al., Science 274, 755 (1996)Google Scholar
3. Berberich, P. et al., Physica C 219, 497 (1994)Google Scholar
4. Egly, J. et al., Appl. Supercond. 1999, IOP Conf. Series 167, 387 (2000)Google Scholar
5. de Boer, B. et al., IEEE Trans. on Appl. Supercond. 11, 3477 (2001)Google Scholar