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Constrained Diffusional Creep in Thin Copper Films

  • D. Weiss (a1), H. Gao (a1) and E. Arzt (a1)


The mechanical properties of thin metal films have been investigated for many years. How- ever, the underlying mechanisms are still not fully understood. In this paper we give an overview of our work on thermomechanical properties and microstructure evolution in pure Cu and dilute Cu-Al alloy films. Very clean films were produced by sputtering and annealing under ultra-high vacuum (UHV) conditions. We described stress-temperature curves of pure Cu films with a constrained diffusional creep model from the literature. In Cu-1at.%Al alloy films, Al surface segregation and oxidation led to a “self-passivating” effect. These films showed an increased high- temperature strength because of the suppression of constrained diffusional creep; however, under certain annealing conditions, these films deteriorated due to void growth at grain boundaries.



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1. Nix, W. D., Metall. Trans. A 20A, 2217–45 (1989).
2. Arzt, E., Acta Mater. 46, 5611–26 (1998).
3. Thouless, M. D., Rodbell, K. P., and Cabral, C. J., J. Vac. Sci. Tech. A 14, 2454–61 (1996).
4. Weiss, D., PhD Thesis, Universität Stuttgart (2000).
5. Flinn, P. A., Gardner, D. S., and Nix, W. D., IEEE Trans. Electr. Dev. ED–34, 689–99 (1987).
6. Keller, R.-M., Baker, S. P., and Arzt, E., J. Mater. Res. 13, 1307–17 (1998).
7. Joo, Y.-C., Müllner, P., Baker, S. P., and Arzt, E., MRS Symp. Proc. Vol. 473, (Philadelphia, PA, 1997), p. 409–14.
8. Li, J., Mayer, J. W., and Colgan, E. G., J. Appl. Phys. 70, 2820–7 (1991).
9. Gibbs, G. B., Phil. Mag. 13, 589–93 (1966).
10. Jackson, M. S. and Li, C.-Y., Acta Met. 30, 19932000 (1982).
11. Thouless, M. D., Acta Met. 41, 1057–64 (1993).
12. Kobrinsky, M. J. and Thompson, C. V., Appl. Phys. Lett. 73, 2429–31 (1998).
13. Gao, H., Zhang, L., Nix, W. D., Thompson, C. V., and Arzt, E., Acta mater. 47, 2865–78 (1999).
14. Vinci, R. P., Zielinski, E. M., and Bravman, J. C., Thin Solid Films 262, 142–53 (1995).
15. Dalbec, T. R., Leung, O. S., and Nix, W. D., in Deformation, Processing, and Properties of Structural Materials, edited by Taleff, E. M., Syn, C. K., and Lesuer, D. R. (The Minerals, Metals & Materials Society, 2000), p. 95108.
16. Weiss, D., Gao, H., and Arzt, E., Acta mater., in press (2001).
17. Weiss, D., Kraft, O., and Arzt, E., Appl. Phys. Lett., submitted (2001).
18. Cocks, A. C. F. and Ashby, M. F., Progr. Mat. Sci. 27, 189244 (1982).

Constrained Diffusional Creep in Thin Copper Films

  • D. Weiss (a1), H. Gao (a1) and E. Arzt (a1)


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