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Concurrent Design of an RTP Chamber and Advanced Control System

Published online by Cambridge University Press:  15 February 2011

Paul Spenc ,
Charles Schaper  and
Ahmad Kermant
Paul Spenc
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
Charles Schaper
Affiliation:
Microelectronics Control and Sensing, Inc. (MCSI), 801 W. El Camino Real, M/S 331, Mountain View, CA 94040.
Ahmad Kermant
Affiliation:
CVC Products, Inc., 47061 Warm Springs Blvd., Fremont, CA 94539.
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Abstract

A concurrent-engineering approach is applied to the development of an axisymmetric rapidthermal-processing (RTP) reactor and its associated temperature controller. Using a detailed finiteelement thermal model as a surrogate for actual hardware, we have developed and tested a multi-input multi-output (MIMO) controller. Closed-loop simulations are performed by linking the control algorithm with the finite-element code. Simulations show that good temperature uniformity is maintained on the wafer during both steady and transient conditions. A numerical study shows the effect of ramp rate, feedback gain, sensor placement, and wafer-emissivity patterns on system performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 389: Symposium R – Modedling and Simulation of Thin-Film Processing , 1995 , 347
Copyright
Copyright © Materials Research Society 1995

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References

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