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Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation

Published online by Cambridge University Press:  01 February 2011

Eva Simonyi ,
Michael Lane ,
Erik Liniger  and
Alfred Grill
Eva Simonyi
Affiliation:
simonyi@us.ibm.com, IBM, Research, 1101 Kitchawan Rd, Yorktown Heights, NY, 10598, United States, 914-945-2515, 914-945-4300
Michael Lane
Affiliation:
mwlane@us.ibm.com, IBM, Research, 1101 Kitchawan Rd, Yorktown Heights, NY, 10598, United States
Erik Liniger
Affiliation:
eliniger@us.ibm.com, IBM, Research, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States
Alfred Grill
Affiliation:
grilla@us.ibm.com, IBM, Research, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States
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Abstract

During the manufacturing process of the BEOL the low-k brittle ILD dielectrics are exposed to wet environments. These environments could and do affect the films fracture toughness, the so called critical film thickness, above which spontaneous cracking occurs. Nanoindentation combined with AFM imaging methods allow to study these phenomena.

Keywords

Typical examples are presented.fracturetoughnessdielectric
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F04-11
Copyright
Copyright © Materials Research Society 2006

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References

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