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Commercial RTP-A SEMATECH Perspective

Published online by Cambridge University Press:  10 February 2011

Tony Speranza
Affiliation:
IBM Burlington, VT
Terry Riley
Affiliation:
AMD Austin, TX
Arun Nanda
Affiliation:
AT&T (Lucent) Orlando, FL
Burt Fowler
Affiliation:
Motorola Austin, TX
Kenneth Torres
Affiliation:
SEMATECH Austin, TX
Franz Geyling
Affiliation:
SEMATECH Austin, TX
Don Lindholm
Affiliation:
SEMATECH Austin, TX
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Abstract

This paper discusses various commercial aspects of Rapid Thermal Processing (RTP). It provides an overview of SEMATECH's efforts to improve the manufacturing viability of RTP. Over the past several years SEMATECH, a U.S. Government/Industry consortium, has identified thermal equipment and processing needs relating to semiconductor manufacturing. It has aggressively pursued solutions to these needs through specific equipment projects. These projects include: RTP Installed Base Productivity Improvement, 0.25um RTP Tool Development, and RTP Modeling and Component Technology. Also discussed are several thermal projects which focus on the performance of more traditional tools. A comparison between RTP and a vertical furnace with model based process control and a small batch fast ramp furnace is made. A brief discussion of an RTP gate stack cluster tool project is followed by a review of future thermal processing needs, including 300mm.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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