Hostname: page-component-848d4c4894-mwx4w Total loading time: 0 Render date: 2024-07-03T01:57:43.923Z Has data issue: false hasContentIssue false

Commercial Applications and Review for Direct Write Technologies

Published online by Cambridge University Press:  10 February 2011

Kenneth H. Church
Affiliation:
CMS Technetronics, Inc., 5202-2 North Richmond Hill Road, Stillwater, OK, U.S.A., 74075
Charlotte Fore
Affiliation:
CMS Technetronics, Inc., 5202-2 North Richmond Hill Road, Stillwater, OK, U.S.A., 74075
Terry Feeley
Affiliation:
Laser Fare, 70 Dean Knauss Dr., Narragansett, RI, U.S.A., 02882
Get access

Abstract

Direct write in the past has generated the excitement of possibly replacing photoresist for all electronic applications. Removing the mask would substantially reduce the number of steps required to produce electronic circuits. A reduction in steps represented time and dollar savings. The advantage of being able to direct write a manufacturable device would also save time and money in the design process as well. With all of the obvious advantages, it seemed inevitable that research dollars would continue to mount and thus overcome the obstacles preventing this technology from becoming more than a novel technique used in laboratories. As Moore's law began to settle in, so did photoresist and direct write was little more than a novelty.

That was then, and this is now. Developers have come to terms with the true value direct write can supply to the manufacturers and design engineers. Techniques such as Focused Ion Beam (FIB), Laser Chemical Vapor Deposition (LCVD), ink jetting and ink penning have found real applications that are making a difference in industry. A summary will be presented describing the various direct write techniques, their current applications and the possible or probable applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Terrill, R., IEEE Aerospace Applications Conference Proceedings (Proceedings of the 1997 IEEE Aerospace Conference, 3, Snowmass Village, CO, 1997) pp. 481488.Google Scholar
2 Terrill, R., Church, K., Moon, M., IEEE Aerospace Applications Conference Proceedings (Proceedings of the 1997 IEEE Aerospace Conference, 1, Snowmass Village, CO, 1997) pp. 377382.Google Scholar
3 Plunkett, T., Time-Compression Technologies, 2000, 5(2) 46 Google Scholar
4 www.3dsystems.com, online reference, 2000.Google Scholar
5 Griffith, M. and Lamancusa, J. S., “Rapid Prototyping Technologies,” Rapid Prototyping, 1998, http://www.me.psu.edu/lamancusa/me415/rpintro2.pdfGoogle Scholar
6 Cornealy, Ken, Moler, Mark, Tech Inc. (Stillwater, OK), private communication, 2000.Google Scholar
7 Renn, M., Phys. Rev. Lett. 75 (18), 3253 (1995).Google Scholar
8 Pique, A., (Mat. Res. Soc., San Francisco, CA) 1998.Google Scholar
9 Ehrlich, D., Osgood, R. Jr., Deutsch, R., IEEE J. Quantum Electronics QE–16 (11), 12331243 (1980)Google Scholar
10 Hayes, D. J., Wallace, D. B., and Cox, W. R., “MicroJet Printing of Solder and Polymers for Multi-Chip Modules and Chip-Scale Packages,” in Proceedings of the IMAPS International Conference on High Density Packaging and MCMs, Denver, April 1999.Google Scholar
11 Miura, K. et al. , Appl. Phys. Lett. 71, 3329 (1997).Google Scholar
12 Bado, P., Laser Focus World, April 2000, 73–78 (2000).Google Scholar
13 Taylor, R. M., Church, K. H., Culver, J., and Eason, S., “Direct-Write Techniques for Fabricating Unique Antennas,” in Materials Development for Direct Write Technologies, edited by Chrisey, D. B., Gamota, D. R., and Helvajian, H. (Mater. Res. Soc., Pittsburgh, PA, 2000), in press.Google Scholar
14 Moore, G., Crossing the Chasm, (Harperbusiness, New York, 1999).Google Scholar
15 Kawaski, G., Garage.com Bootcamp for Startups, Seattle, WA, 2000.Google Scholar