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Chemistry Of Solid/Solid Interfaces

Published online by Cambridge University Press:  15 February 2011

R. L. Opila
R. L. Opila*
Affiliation:
AT&T Bell Labs, 600 Mountain Avenue, Murray Hill, NJ 07974
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Abstract

The chemistry that occurs at buried interfaces often determines the performance and reliability of multi-chip modules (MCM's). For example, chemical reactions between sputter deposited metals and polymers may ultimately determine the interlayer adhesion of multilevel metallizations for MCM's. Both destructive and non-destructive probes can used to study these interfaces, and the interfaces may be studied as they are formed or as they age. Complicating the interpretation of any of the results of these techniques is the inherent complexity of the chemistry and, often, the non-planarity of the interface. Several examples of complex interfaces will be described along with strategies for elucidating the chemistry and their reliability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 225
Copyright
Copyright © Materials Research Society 1992

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