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Chemistry Of Solid/Solid Interfaces

  • R. L. Opila (a1)

Abstract

The chemistry that occurs at buried interfaces often determines the performance and reliability of multi-chip modules (MCM's). For example, chemical reactions between sputter deposited metals and polymers may ultimately determine the interlayer adhesion of multilevel metallizations for MCM's. Both destructive and non-destructive probes can used to study these interfaces, and the interfaces may be studied as they are formed or as they age. Complicating the interpretation of any of the results of these techniques is the inherent complexity of the chemistry and, often, the non-planarity of the interface. Several examples of complex interfaces will be described along with strategies for elucidating the chemistry and their reliability.

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