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Characterization of SiC Implanted with B or Al Using Thermal Admittance Spectroscopy

Published online by Cambridge University Press:  01 February 2011

S.R. Smith ,
M.A. Capano  and
A.O. Evwaraye
S.R. Smith
Affiliation:
University of Dayton Research Institute, 300 College Park, Dayton, OH 45469-0178
M.A. Capano
Affiliation:
Purdue University, Department of Electrical and Computer Engineering, West Lafayette, IN 47907
A.O. Evwaraye
Affiliation:
University of Dayton, Physics Department, 300 College Park, Dayton, OH 45469-2314
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Abstract

We have measured the thermal activation energies of electrically active defects in 4H- and 6H-SiC implanted with either Al or B ions, using Thermal Admittance Spectroscopy. The net acceptor concentrations were monitored using room temperature low frequency Capacitance-Voltage measurements. The substrates were n/n+ epilayers. The implantations plus annealing produced p-type layers that were acceptable for characterization. The specimens were annealed in Ar at 1600 ° C, after which Ni Schottky diodes were fabricated on the specimens. Annealing times were 5, 15, 30, and 60 min. In some of the specimens, a shallow level was found that did not correspond to known levels. As the annealing progressed, energy shifts were noted for some of the detected levels. In some specimens, the implanted p-type impurity and the n-type residual dopants in the substrate were simultaneously detected. Measurements of electrically active ptype species were compared to “control” specimens implanted with Ar. From this comparison, we conclude that at least one shallow donor level is introduced into the bandgap by the implantation process, and is not annealed out. The defects associated with the implantation may affect actual device performance of diodes by destabilizing the lattice occupation of the implanted dopant atoms (energy shift with annealing), and act as lifetime killers.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 719: Symposium F – Defect- and Impurity-Engineered Semiconductors and Devices III , 2002 , F8.16
Copyright
Copyright © Materials Research Society 2002

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References

1. Kimoto, T., Inoue, N., and Matsunami, H., Phys. Stat. Sol. (a) 162, 263 (1997)Google Scholar
2. Troffer, T., Schadt, M., Frank, T., Itoh, H., Pensl, G., Heindl, J., Strunk, H.P., and Maier, M., Phys. Stat. Sol. (a) 162, 277 (1997)Google Scholar
3. Capano, M.A., Santhakumar, R., Venugopal, R., Melloch, M.R., Cooper, J.A. Jr, ‘Phosphorus Implantation into 4H-Silicon Carbide,’ J. Electronic Mater. 29, 210 (2000)Google Scholar
4. Kimoto, T., Takemura, O., Matsunami, H., Nakata, T., and Inoue, M., J. Electronic Mater. 27, 358 (1998)Google Scholar
5. Losee, D.L., J. Appl. Phys. 46, 2204 (1975)Google Scholar
6. Evwaraye, A.O., Smith, S.R., and Mitchel, W.C., J. Appl. Phys. 75, 3472 (1994)Google Scholar
7. Smith, S.R., Evwaraye, A.O., and Mitchel, W.C., Phys. Stat. Sol. (a) 162, 227 (1997)Google Scholar
8. Smith, S.R., Evwaraye, A.O., and Mitchel, W.C., Mater. Res. Soc. Symp. Proc. 510, 193 (1998)Google Scholar
9. Sridhara, S.G., Clemen, L.L., Devaty, R.P., Choyke, W.J., Larkin, D.J., Kong, H.S., Troffer, T., and Pensl, G., J. Appl. Phys. 83, 7909 (1998)Google Scholar
10. Nakano, Yoshitaka, Malhan, Rajesh Kumar, Kachi, Tetsu, and Tadano, Hiroshi, J. Appl. Phys. 89, 5961 (2001)Google Scholar
11. Mitchel, W.C., Roth, M., Evwaraye, A.O., Yu, P.W., and Smith, S.R., J. Electron. Mater. 25, 863 (1996)Google Scholar
12. Evwaraye, A.O., Smith, S.R., and Mitchel, W.C., Appl. Phys. Lett., 71, 1186 (1997)Google Scholar
13. Rao, Mulpuri V., Tucker, Jesse B., Ridgeway, M.C., Holland, O.W., Papanicolaou, N., and Mittereder, J., J. Appl. Phys., 86, 752 (1999)Google Scholar