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Characterization of PSG Films Reflowed in Steam Using Rapid Thermal Processing

Published online by Cambridge University Press:  26 February 2011

N. Shah ,
J. M. C. Vittie ,
N. Sharif ,
J. Nulman  and
A. Gat
N. Shah
Affiliation:
A.G. Associates, 1325 Borregas, Sunnyvale, CA 94089
J. M. C. Vittie
Affiliation:
Stanford University, Dept. of Electrical Engineering, Stanford, CA 94305
N. Sharif
Affiliation:
A.G. Associates, 1325 Borregas, Sunnyvale, CA 94089
J. Nulman
Affiliation:
Cornell University, National Submicron Facility, Ithaca, NY 14853
A. Gat
Affiliation:
A.G. Associates, 1325 Borregas, Sunnyvale, CA 94089
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Abstract

This study describes the use of a steam environment to reflow phosphosilicate glass (PSG) samples using a HEATPULSE® rapid thermal annealer. The samples comprised PSG over poly steps and of open contacts in PSG. It was observed that reflow occurs 50°C lower in steam than in dry O2. An acceptable flow cycle for 8 w/o P in PSG glass is 1050°C for 10 seconds in steam, while for 6 w/o P PSG it is 1100°C for 10 seconds. Steam is found to be an effective amibient for densification of the PSG film. The thermal oxide grown in the contact during opening reflow was determined to be near 140 A. The operating regime for a junction depth <0.4 um and a reflow angle < 75° is presented for 8 w/o P.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 52: Symposium B – Rapid Thermal Processing , 1985 , 233
Copyright
Copyright © Materials Research Society 1986

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