Hostname: page-component-76fb5796d-x4r87 Total loading time: 0 Render date: 2024-04-27T03:31:06.731Z Has data issue: false hasContentIssue false

Characterization of Oxygen-Doped and Non-Oxygen-Doped Polysilicon Films Prepared by Rapid Thermal Chemical Vapor Deposition

Published online by Cambridge University Press:  21 February 2011

Xiaoli Xu
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-7911
Veena Misra
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-7911
Gari S. Harris
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7916
Lycourgos Spanos
Affiliation:
Department of Chemistry, University of North Carolina at Chapel Hill, Chapel Hill, NC 27599-3290
Mehmet C. Öztiirk
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-7911
Jimmie J. Wortman
Affiliation:
Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27695-7911
Dennis M. Maher
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695-7916
Eugene A. Irene
Affiliation:
Department of Chemistry, University of North Carolina at Chapel Hill, Chapel Hill, NC 27599-3290
Get access

Abstract

PolySi films deposited with and without oxygen doping using rapid thermal chemical vapor deposition (RTCVD) have been investigated. Experimental results show that RTCVD systems can be used to provide high deposition rates ( 900-1000 Å/min at 700 °C) for both oxygen-doped and non-oxygen-doped polySi films. The surface roughness of the RTCVD polySi film is about half that of conventional LPCVD polySi films. The surface roughness and grain size of the RTCVD polySi film can be further reduced using oxygen doping. The catastrophic breakdown strength for capacitors using oxygen-doped polySi electrodes are improved compared with the breakdown strength for capacitors using non-oxygen-doped polySi electrodes. Electrical resistivities of B, P and As doped samples of polySi films with oxygen doping are found to be larger than those of polySi films without oxygen doping. Resistivities of silicides formed on the oxygen-doped polySi samples are approximately the same for those of silicides formed on non-oxygen-doped polySi samples.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Foster, D., Learn, A., and Kamins, T., Solid State Technology, 29, 227 (1986).Google Scholar
2. Kamins, T. I., Mandurah, M. M., and Saraswat, K. C., J. Electrochem. Soc. 125, 927 (1978).Google Scholar
3. Pan, P., Kermani, A., Berry, W., and Liao, J., Mar. Res. Soc. Symp. Proc., 146,47 (1989).Google Scholar
4. Xu, X.-L., Wortman, J. J., Oztiirk, M. C., and Sorrel, F. Y., Proc. SPIE Technical Symp. on Microelectronics, San Jose, 1595, 18 (1991).Google Scholar
5. Sze, S. M., VLSI Technology (McGraw-Hill Book Company, New York, 1988).Google Scholar
6. Kamins, T. I., Turner, J. E., Solid State Technology, 33, 80 (1990).Google Scholar
7. Murota, J. and Sawai, T., J. Appl. Phys., 53, 3702 (1982).CrossRefGoogle Scholar