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Ceramics in Microelectronics Packaging: Past, Present and Future

Published online by Cambridge University Press:  21 February 2011

Rao R. Tummala
Rao R. Tummala*
Affiliation:
IBM East Fishkill, Route 52, Hopewell Junction, NY 12533
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Abstract

A broad review of ceramics in microelectronics for processing, storing, transferring, printing, and displaying information is highlighted. Ceramic packaging is presented with a review of the history, evolution, and state of the art. The recent developments in ceramics resulting in potentially improved thermal and electrical properties by the use of SiC, AIN, and glass±ceramics are discussed. The scientific understanding necessary to support these developments is mentioned.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 379
Copyright
Copyright © Materials Research Society 1989

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References

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