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Ceramic Fiber Composites for Electronic Packaging: Thermal Transport Properties

Published online by Cambridge University Press:  21 February 2011

Hongmei Zhang ,
David G. Onn  and
Ohn D. Bolt
Hongmei Zhang
Affiliation:
ATPL, Department of Physics & Astronomy, University of Delaware, Newark, DE 19716
David G. Onn
Affiliation:
ATPL, Department of Physics & Astronomy, University of Delaware, Newark, DE 19716
Ohn D. Bolt
Affiliation:
Experimental Station, E. I. DuPont de Nemours and Co., Wilmington, DE, 19898.
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Abstract

The thermal diffusivities and specific heats of several polymer matrix composites containing ceramic Fiber FP [1] and AIN fibers were measured between 20 K and 300 K. The anisotropic thermal conductivities inferred are related to specific fiber geometries and the thermal conductivities of the composite components. The high in-plane conductivities at 125K suggest possible applications for high-Tc, superconductor electronic packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 187
Copyright
Copyright © Materials Research Society 1990

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References

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