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Catalysis of Electroless Copper Plating using Pd+2/Poly(Acryilc Acid) TIIIN Films

Published online by Cambridge University Press:  25 February 2011

Robert L. Jackson
Robert L. Jackson*
Affiliation:
IBM Almaden Research Center, San Jose, California 95120–6099
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Abstract

A new method is described for initiating electroless copper deposition onto dielectric substrates. The method employs a thin poly(acrylic acid) film, applied to the substrate by dip-coating, to bind Pd+2 from PdSO4 solution. Uptake of Pd+2 takes place by H+/Pd+2 ion exchange at the carboxylic acid sites of the polymer. Upon immersion of a substrate treated with Pd+2/poly(acrylic acid) into an electroless copper plating bath, reduction of Pd+2 to Pd0 takes place, forming an active catalyst for the initiation of electroless copper plating.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 131: Symposium E – Chemical Perspectives of Microelectronic Materials I , 1988 , 587
Copyright
Copyright © Materials Research Society 1989

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References

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