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Carrier Transport in Ultra-Thin Nano/Polycrystalline Silicon Films and Nanowires

Published online by Cambridge University Press:  17 March 2011

Toshio Kamiya
Affiliation:
Materials and Structure Laboratory, Tokyo Institute of Technology, Japan Microelectronics Research Centre, Cavendish Laboratory, University of Cambridge, UK CREST, JST, Japan
Yong T. Tan
Affiliation:
Microelectronics Research Centre, Cavendish Laboratory, University of Cambridge, UK CREST, JST, Japan
Yoshikazu Furuta
Affiliation:
Hitachi-Cambridge Laboratory, UK CREST, JST, Japan
Hiroshi Mizuta
Affiliation:
Hitachi-Cambridge Laboratory, UK CREST, JST, Japan
Zahid A.K. Durrania
Affiliation:
Microelectronics Research Centre, Cavendish Laboratory, University of Cambridge, UK CREST, JST, Japan
Haroon Ahmed
Affiliation:
Microelectronics Research Centre, Cavendish Laboratory, University of Cambridge, UK CREST, JST, Japan
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Abstract

Carrier transport was investigated in two different types of ultra-thin silicon films, polycrystalline silicon (poly-Si) films with large grains > 20 nm in size and hydrogenated nanocrystalline silicon (nc-Si:H) films with grains 4 nm – 8 nm in size. It was found that there were local non-uniformities in grain boundary potential barriers in both types of films. Single-electron charging effects were observed in 30 nm × 30 nm nanowires fabricated in 30 nm-thick nc-Si:H films, where the electrons were confined in crystalline silicon grains encapsulated by amorphous silicon. In contrast, the poly-Si nanowires of similar dimensions showed thermionic emission over the grain boundary potential barriers formed by carrier trapping in grain boundary defects.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Meier, J., Dubail, S., Cuperus, J. et al. , J. Non-Cryst. Sol. 227–230, 1250 (1998).Google Scholar
2. Sameshima, T., Applied Surface Science 96–98, 352 (1996).Google Scholar
3. Kamiya, T., Nakahata, K., Fortmann, C.M. and Shimizu, I., J. Non-Cryst. Sol. 266–269, 120 (2000).Google Scholar
4. Fejfar, A., Rezek, B., Knapek, P., Stuchlik, J. and Kocka, J., J. Non-Cryst. Sol. 266–269, 309 (2000).Google Scholar
5. Tringe, J. W., and Plummer, J.D.: J. Appl. Phys. 49, 7913 (2000).Google Scholar
6. Furuta, Y., Mizuta, H., Nakazato, K., Tan, Y.-T., Kamiya, T., Durrani, Z.A.K., Ahmed, H. and Taniguchi, K., Jpn. J. Appl. Phys. Lett. (2001) accepted.Google Scholar
7. Tan, Y.T., Durrani, Z.A.K. and Ahmed, H., J. Appl. Phys. 89, 1262 (2001).Google Scholar
8. Kamiya, T., Nakahata, K., Ro, K., Fortmann, C.M. and Shimizu, I., Jpn. J. Appl. Phys. 38, 5750 (1999).Google Scholar
9. Vallat-Sauvain, E., Kroll, U., Meier, J., Wyrsch, N. and Shah, A., J. Non-Cryst. Sol. 266–269, 125 (2000).Google Scholar
10. Tan, Y.T., Kamiya, T., Durrani, Z.A.K. and Ahmed, H., Appl. Phys. Lett. 78, 1083 (2001).Google Scholar
11. Kamiya, T., Nakahata, K., Tan, Y.T., Durrani, Z.A.K. and Shimizu, I., J. Appl. Phys. (June, 2001) in print.Google Scholar
12. Kamins, T., Polycrystalline silicon for integrated circuits and display, 2nd ed (Kluwer, Boston, 1998).10.1007/978-1-4615-5577-3Google Scholar