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Calculation of Stress Gradients in Thin Al-0.5%Cu/Ti Lines from Strain Gradients Measured as a Function of Temperature Using Grazing Incidence X-Ray Scattering

Published online by Cambridge University Press:  22 February 2011

Paul Besser ,
Ramnath Venkatraman ,
Sean Brennen  and
John Bravman
Paul Besser
Affiliation:
Materials Science Department, Stanford University, Stanford, CA 94305
Ramnath Venkatraman
Affiliation:
Materials Science Department, Stanford University, Stanford, CA 94305
Sean Brennen
Affiliation:
Stanford Synchrotron Radiation Lab, Menlo Park, CA 94025
John Bravman
Affiliation:
Materials Science Department, Stanford University, Stanford, CA 94305
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Abstract

Strain gradients in Al-0.5%Cu lines on a 1000Å Ti barrier layer have been measured during thermal cycling from room temperature to 400°C using X-rays from a Synchrotron Source in the Crazing Incidence Geometry. The stress gradient calculated from the strain gradient is shown at four temperatures during thermal cycling. The surface of the line is relaxed relative to the bulk during heating and more stressed during cooling. It was also found that the width direction of the line supports essentially no stress throughout the thermal cycle and that the much of the stress along the length of the line is relaxed during the first few minutes at elevated temperatures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 233
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

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