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Buckling failure of compressive loaded hard layers in flexible devices

Published online by Cambridge University Press:  01 February 2011

Piet C.P. Bouten  and
Marcel A.J. van Gils
Piet C.P. Bouten
Affiliation:
Philips Research Laboratories, Eindhoven, The Netherlands.
Marcel A.J. van Gils
Affiliation:
Philips Centre for Industrial Technology, Eindhoven, The Netherlands.
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Abstract

Substrate materials for flexible devices are multi-layer composite structures. On top of a base polymer functional inorganic layers such as permeation barriers and conductive layers are applied. Due to the thermal mismatch between polymer and inorganic layer, the layer is compressive loaded at ambient conditions. A characteristic failure mode, occurring with compressive loaded thin layers, is buckling failure. The interface between adjacent layers fails locally, and the thin top layer bends outwards. The buckles have a characteristic width and height. These sizes are used to analyse the compressive strain, present in the layer before failure, and the adhesion quality of the failed interface. A buckle map is introduced to guide this analysis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 843: Symposium T – Surface Engineering-Fundamentals and Applications , 2004 , T4.9
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Hutchinson, J.W. and Suo, Z., Advances in Applied Mechanics 29 63 (1992).Google Scholar
2. Fang, W. and Wickert, J. A., J. Micromech. Microeng. 4 116 (1994).Google Scholar
3. Cotterell, B. and Chen, Z., Int. J. Fracture 104 169 (2000).Google Scholar
4. Yu, H.H. and Hutchinson, J.W., Int. J. Fracture 113 39 (2002).Google Scholar
5. Ambrico, J.M. and Begley, M.R., Thin Solid Films 419 144–153 (2002).Google Scholar