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Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials

  • Michael I. Current (a1), Shari N. Farrens (a1), Martin Fuerfanger (a1), Sien Kang (a1), Harry R. Kirk (a1), Igor J. Malik (a1), Lucia Feng (a1) and Francois J. Henley (a1)...

Abstract

An innovative suite of layer transfer technologies, collectively called the NanoCleaveTM Process, includes a non-porous cleave plane utilizing a compressive strain layer, growth of a high purity, crystalline device layer, plasma activation coupled with vacuum bonding, room-temperature cleaving along an atomically flat plane and a variety of post-cleave CVD processes to thicken or thin the device layer to a desired final thickness is described. Applications of this process include fabrication of SOI wafers containing Si and SiGe alloy device layers.

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1. Current, M.I., Malik, I.J., Fuerfanger, M., Korolik, M., Kang, S., Kirk, H., Fang, M., Farrens, S.N., Henley, F.J., in “Silicon-on-Insulator Technology and Devices X”, eds. Cristoloveanu, S. et al. , Electrochemical Society, Proc. 2001–3 (2001) 7578.
2. Farrens, S. N., Dekker, J.R., Smith, J. K., Roberds, B. E., J. Electrochem. Soc. 142 (11) (1995) 39493955.
3. Langbein, D., J. Adhesion 3 (1972) 213235.
4. Roberts, S.G., in “Properties of Crystalline Silicon”, ed. Hull, R., INSPEC (1999) 144148.
5. Thilderkvist, A-L., Kang, S., Fuerfanger, M., Malik, I.J., 2000 IEEE Inter. SOI Conf., October, 2000, 1213.
6. Current, M.I., Malik, I.J., Bedell, S.W., Kirk, H., Korolik, M., Kang, S., Henley, F.J., in “High Purity Silicon VI”, eds. Claeys, C.L. et al. , Electrochemical Society, Proc. 2000–17 (2000) 516523.
7. Current, M.I., Bedell, S.W., Malik, I. J., Feng, L.M., Henley, F.J., Solid State Technology, (July, 2000), 6677.

Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials

  • Michael I. Current (a1), Shari N. Farrens (a1), Martin Fuerfanger (a1), Sien Kang (a1), Harry R. Kirk (a1), Igor J. Malik (a1), Lucia Feng (a1) and Francois J. Henley (a1)...

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